Loading...

MC10H352FNR2G

Onsemi

MC10H352FNR2G by Onsemi

MC10H352FNR2G by Onsemi is a voltage level translator with 4 functions, operating at 5V. It has a max supply voltage of 5.25V and min of 4.75V, suitable for commercial extended temperature grade applications. This TTL/CMOS to PECL translator offers fast performance with a max delay of 2ns in a compact chip carrier package.

Median Price

$10.530

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$9.360

1k+ parts

$8.370

10k+ parts

$7.880

2,500

-

$9.360

$8.370

$7.880

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$11.700

1k+ parts

$10.463

10k+ parts

-

2,500

-

$11.700

$10.463

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 976 parts In-Stock

1+ parts

$8.590

100+ parts

-

1k+ parts

-

10k+ parts

-

976

$8.590

-

-

-

Digiode

USA . 1,328 parts In-Stock

1+ parts

$9.899

100+ parts

-

1k+ parts

-

10k+ parts

-

1,328

$9.899

-

-

-

Freddi Giovanni

Italy . 400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

400

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 252 parts In-Stock

1+ parts

$8.590

100+ parts

-

1k+ parts

-

10k+ parts

-

252

$8.590

-

-

-

Corphita

USA . 1,310 parts In-Stock

1+ parts

$9.378

100+ parts

-

1k+ parts

-

10k+ parts

-

1,310

$9.378

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 27,882 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,882

-

-

-

-

TANS Electronics

Latvia . 4,516 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,516

-

-

-

-

SupplyDigital Components

Austria . 3,299 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,299

-

-

-

-

Problanco Electronics

Mexico . 2,793 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,793

-

-

-

-

Continental Prestige Electronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$9.220

1k+ parts

-

10k+ parts

-

2,500

-

$9.220

-

-

Kulean Microsystems

USA . 922 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

922

-

-

-

-

UHIMA Technologies

Türkiye . 653 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

653

-

-

-

-

Microchip USA

USA . 457 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

457

-

-

-

-

Overview

Unlock the power of seamless voltage level translation with the MC10H352FNR2G by Onsemi. Designed with precision and reliability in mind, this versatile chip carrier is perfect for a wide range of applications. From TTL/CMOS to PECL translation, this high-quality product offers unparalleled performance and efficiency. Say goodbye to compatibility issues and hello to smooth operation with the MC10H352FNR2G. Upgrade your electronic designs today with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for reliable performance and easy handling.

Surface Mount: YES

Convenient installation on PCBs for space-saving.

Maximum Supply Voltage: 5.25 V

Allows for compatibility with various voltage levels, providing versatility.

No. of Functions: 4

Multipurpose design for addressing multiple translation needs in one component.

Package Shape: SQUARE

Efficient use of space on the PCB for better layout.

Power Supplies (V): 5

Suitable for standard power requirements, ensuring compatibility with existing systems.

No. of Terminals: 20

Sufficient connection options for various input and output configurations.

Package Style (Meter): CHIP CARRIER

Modern package style for easy handling and installation.

Minimum Supply Voltage: 4.75 V

Allows for operation at lower voltage levels, enhancing flexibility.

Maximum Operating Temperature: 75 °C

Can withstand high temperatures for reliable performance in different environments.

Output Characteristics: OPEN-EMITTER

Flexible output configuration for diverse applications.

Minimum Operating Temperature: 0 °C

Works in a wide temperature range, suitable for various operating conditions.

Terminal Finish: TIN

Corrosion-resistant finish for long-lasting usage.

Terminal Position: QUAD

Efficient layout for easy connection and troubleshooting.

Maximum Seated Height: 4.57 mm

Low-profile design for compact installations.

Width: 8.965 mm

Compact size for space-efficient PCB layouts.

Output Polarity: COMPLEMENTARY

Versatile output polarity options for different system requirements.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes for reliable assembly.

Length: 8.965 mm

Compact size for space-efficient PCB layouts.

Temperature Grade: COMMERCIAL EXTENDED

Suitable for commercial applications with extended temperature requirements.

Technology: ECL

High-speed technology for efficient signal translation.

Terminal Form: J BEND

Convenient terminal shape for easy soldering and connections.

Nominal Supply Voltage: 5 V

Standard voltage level for compatibility with existing systems.

Maximum Delay: 2 ns

Low delay time for fast signal processing.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy connection to PCBs.

Interface IC Type: TTL/CMOS TO PECL TRANSLATOR

Designed for translating between TTL/CMOS and PECL interfaces, offering versatile compatibility.

Technical Specifications

Voltage Level Translators MC10H352FNR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10H352FNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20