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MC10H607FNG

Onsemi

MC10H607FNG by Onsemi

MC10H607FNG by Onsemi is a voltage level translator with 6 functions, operating at 5V. It has a max supply voltage of 5.25V and min of 4.75V, suitable for PECL to TTL translation applications. The chip carrier package style measures 11.505mm in width and length, with a terminal pitch of 1.27mm for surface mount assembly at temperatures ranging from 0 to 85 °C.

Median Price

$8.090

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,058 parts In-Stock

1+ parts

-

100+ parts

$6.980

1k+ parts

$6.250

10k+ parts

$5.880

1,058

-

$6.980

$6.250

$5.880

DigiKey

USA . 1,058 parts In-Stock

1+ parts

-

100+ parts

$8.090

1k+ parts

$8.090

10k+ parts

$8.090

1,058

-

$8.090

$8.090

$8.090

Verical

USA . 1,058 parts In-Stock

1+ parts

-

100+ parts

$8.725

1k+ parts

$7.813

10k+ parts

$7.350

1,058

-

$8.725

$7.813

$7.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,306 parts In-Stock

1+ parts

$6.830

100+ parts

-

1k+ parts

-

10k+ parts

-

2,306

$6.830

-

-

-

Digiode

USA . 1,025 parts In-Stock

1+ parts

$7.391

100+ parts

-

1k+ parts

-

10k+ parts

-

1,025

$7.391

-

-

-

DigiKey Marketplace

USA . 1,058 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,058

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 86 parts In-Stock

1+ parts

$6.830

100+ parts

-

1k+ parts

-

10k+ parts

-

86

$6.830

-

-

-

Corphita

USA . 831 parts In-Stock

1+ parts

$7.002

100+ parts

-

1k+ parts

-

10k+ parts

-

831

$7.002

-

-

-

SupplyDigital Components

Austria . 4,123 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,123

-

-

-

-

Kulean Microsystems

USA . 4,095 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,095

-

-

-

-

TANS Electronics

Latvia . 1,718 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,718

-

-

-

-

Problanco Electronics

Mexico . 1,638 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,638

-

-

-

-

Continental Prestige Electronics

USA . 1,058 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,058

-

-

-

-

UHIMA Technologies

Türkiye . 777 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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777

-

-

-

-

Microchip USA

USA . 193 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

193

-

-

-

-

Overview

Unlock the potential of your electronic designs with the MC10H607FNG by Onsemi. As a leading manufacturer, Onsemi guarantees top-notch quality and reliability. This voltage level translator is versatile and ideal for a wide range of applications. Offering seamless translation between PECL to TTL, this product ensures smooth and efficient operation. Trust in Onsemi's expertise and elevate your projects with the MC10H607FNG. Experience the value and benefits it brings to your work today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures compatibility with a wide range of systems and devices.

No. of Functions: 6

Having 6 functions in a single device increases functionality and reduces the need for additional components.

Package Shape: SQUARE

The square package shape allows for easy placement on circuit boards and efficient use of space.

Minimum Operating Temperature: 0 °C

The product can operate in a wide range of temperatures, making it suitable for various environments.

Maximum Delay: 8.3 ns

The low maximum delay ensures fast signal processing, crucial for high-performance applications.

Technical Specifications

Voltage Level Translators MC10H607FNG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

8.3 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Latch/Register:

REGISTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10H607FNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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