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MC100ELT28D

Onsemi

MC100ELT28D by Onsemi

MC100ELT28D by Onsemi is a voltage level translator with 2 functions, operating b/w -40 to 85 °C. It has a supply voltage range of 4.75-5.25 V and max delay of 5.5 ns. Ideal for PECL-TTL/TTL-PECL translation in industrial applications due to its ECL technology and small outline package design.

Median Price

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Lifecycle Status

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8

In-Stock Inventory

1k+

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Digiode

USA . 2,234 parts In-Stock

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Vyrian

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Electronics Depot

USA . 457 parts In-Stock

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Bristol Electronics

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Goldney Electronics S.L.

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ACDS - Activité Composants Distribution Service

France . 56 parts In-Stock

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Prism Electronics

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A2Z Electronics, Inc.

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Benley Electronics

USA . 21 parts In-Stock

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Problanco Electronics

Mexico . 6,862 parts In-Stock

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TANS Electronics

Latvia . 6,021 parts In-Stock

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SupplyDigital Components

Austria . 3,581 parts In-Stock

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Kulean Microsystems

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Corphita

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Corohmni

South Africa . 447 parts In-Stock

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UHIMA Technologies

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock seamless voltage level translation with the MC100ELT28D by Onsemi. This versatile device offers high-quality performance in a compact package, making it perfect for a wide range of applications. With Onsemi's reputation for reliability and innovation, you can trust that this voltage level translator will exceed your expectations. Whether you're working on industrial automation or telecommunications projects, the MC100ELT28D delivers value, efficiency, and peace of mind. Elevate your designs with the precision and reliability of Onsemi's MC100ELT28D.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring reliable performance and ease of handling.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

Can handle a high maximum supply voltage, providing flexibility and compatibility with a wide range of systems.

No. of Functions: 2

Having 2 functions in one device simplifies circuit design and integration, reducing component count and overall system complexity.

Package Shape: RECTANGULAR

Rectangular shape is space-efficient and allows for easy placement on the PCB, optimizing layout and reducing footprint.

Power Supplies (V): 5

Operates at a standard power supply voltage of 5V, making it compatible with common electronic systems and reducing the need for additional voltage regulation.

No. of Terminals: 8

Having 8 terminals provides multiple connection points for easy interfacing with other components and circuits, enabling versatile usage.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, allowing for compact designs and efficient use of board real estate.

Minimum Supply Voltage: 4.75 V

Can operate at a relatively low minimum supply voltage, ensuring compatibility with a wide range of power sources and systems.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, allowing for reliable performance in demanding industrial environments.

Output Characteristics: OPEN-EMITTER

Open-emitter output characteristics offer flexibility in connecting to different types of loads, making it adaptable to various applications.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, making it suitable for use in harsh environmental conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and ensures secure connections during assembly, contributing to overall reliability.

Terminal Position: DUAL

Dual terminal position allows for easy and convenient connection to external circuits, simplifying installation and integration.

Maximum Seated Height: 1.75 mm

Low profile design with a maximum seated height of 1.75 mm saves space and facilitates compact PCB layout.

Width: 3.9 mm

Narrow width of 3.9 mm enables close placement of multiple components, optimizing board layout and minimizing signal interference.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies interfacing with other components and ensures proper signal transmission, enhancing overall system performance.

Peak Reflow Temperature °C: 235

Peak reflow temperature of 235 °C allows for reliable and secure soldering during assembly, ensuring long-term stability and performance.

Length: 4.9 mm

Compact length of 4.9 mm facilitates space-efficient placement on the PCB, contributing to overall design efficiency.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions and high-temperature environments, making it suitable for industrial applications.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making it ideal for applications that require fast signal processing and efficient power management.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and facilitates easy soldering, ensuring secure connections and reliable performance.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V ensures compatibility with standard electronic systems, simplifying integration and reducing the need for additional voltage regulation.

Maximum Delay: 5.5 ns

Low maximum delay of 5.5 ns enables fast signal processing and reduces latency, making it suitable for high-speed applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27 mm allows for easy connection to external circuits and components, facilitating seamless integration and installation.

Interface IC Type: PECL-TTL/TTL-PECL TRANSLATOR

PECL-TTL/TTL-PECL translator interface IC type provides compatibility with different signal levels, allowing for seamless communication between devices with different voltage requirements.

Technical Specifications

Voltage Level Translators MC100ELT28D attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

5.5 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC100ELT28D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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