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MC100LVELT23MNR4G

Onsemi

MC100LVELT23MNR4G by Onsemi

MC100LVELT23MNR4G by Onsemi is a Voltage Level Translator with 2 functions, operating at 3.3V. It has a max delay of 2.5ns and interfaces as PECL to TTL translator. Ideal for industrial applications requiring precise signal translation in compact spaces due to its small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,307 parts In-Stock

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Digiode

USA . 1,453 parts In-Stock

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TANS Electronics

Latvia . 7,948 parts In-Stock

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Problanco Electronics

Mexico . 6,361 parts In-Stock

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Kulean Microsystems

USA . 1,862 parts In-Stock

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SupplyDigital Components

Austria . 1,417 parts In-Stock

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Corphita

USA . 787 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 317 parts In-Stock

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Corohmni

South Africa . 194 parts In-Stock

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Overview

Upgrade your voltage level translation needs with the MC100LVELT23MNR4G by Onsemi. This cutting-edge product offers high-quality performance and reliability, backed by the reputable manufacturer, Onsemi. Ideal for a wide range of applications, this voltage level translator provides seamless integration and compatibility, enhancing the efficiency of your projects. Experience the value and benefits of this innovative solution, delivering unparalleled advantages to customers seeking top-notch performance and quality in their electronic designs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.8 V

Supports a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 2

Provides multiple functions in a single device, offering flexibility and cost-effectiveness.

Package Shape: SQUARE

Square package shape is compact and efficient, ideal for space-constrained board designs.

Power Supplies (V): 3.3

Compatible with common power supply voltages, ensuring easy integration into existing systems.

No. of Terminals: 8

Sufficient number of terminals for connecting various input and output signals, enhancing connectivity options.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Small outline, heat sink/slug, and very thin profile design optimize thermal management and space utilization on the PCB.

Minimum Supply Voltage: 3 V

Can operate at low supply voltages, suitable for energy-efficient applications or battery-powered devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows operation in both extreme cold and hot conditions, increasing product versatility.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit connections and routing options for better signal integrity.

Maximum Seated Height: 1 mm

Low profile design with maximum seated height of 1mm saves space and enables compact PCB layouts.

Width: 2 mm

Narrow width of 2mm facilitates dense board designs and allows for close component placement.

Output Polarity: TRUE

True output polarity ensures accurate signal conversion and compatibility with downstream components.

Length: 2 mm

Compact length of 2mm contributes to overall space-saving and efficient board utilization.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Technology: ECL

ECL technology offers high-speed and low-power consumption characteristics, suitable for demanding applications requiring fast signal processing.

Terminal Form: NO LEAD

No-lead terminal form simplifies the assembly process and enhances reliability in high-vibration environments.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent device performance and compatibility with standard voltage levels.

Maximum Delay: 2.5 ns

Low maximum delay of 2.5ns ensures quick signal translation and minimal signal distortion, crucial for maintaining signal integrity.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5mm allows for high-density mounting and precise signal routing on the PCB.

Interface IC Type: PECL TO TTL TRANSLATOR

Specific interface IC type for translating between PECL and TTL logic levels, enabling signal compatibility between different systems.

Technical Specifications

Voltage Level Translators MC100LVELT23MNR4G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.5 ns

Interface IC Type:

JESD-30 Code:

S-XDSO-N8

Length:

2 mm

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

MC100LVELT23MNR4G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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