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MC10H350FNR2G

Onsemi

MC10H350FNR2G by Onsemi

MC10H350FNR2G by Onsemi is a voltage level translator with 4 functions, operating at 5V. It features ECL technology, 3-STATE output characteristics, and PECL to TTL translation. Ideal for applications requiring fast signal conversion in commercial extended temperature environments.

Median Price

$9.820

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8 parts In-Stock

1+ parts

-

100+ parts

$9.820

1k+ parts

$8.790

10k+ parts

$8.270

8

-

$9.820

$8.790

$8.270

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 680 parts In-Stock

1+ parts

$10.393

100+ parts

-

1k+ parts

-

10k+ parts

-

680

$10.393

-

-

-

Vyrian

USA . 5,683 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,683

-

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Benley Electronics

USA . 1 parts In-Stock

1+ parts

$1.750

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$1.750

-

-

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Corphita

USA . 632 parts In-Stock

1+ parts

$9.846

100+ parts

-

1k+ parts

-

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-

632

$9.846

-

-

-

Corohmni

South Africa . 358 parts In-Stock

1+ parts

$10.940

100+ parts

-

1k+ parts

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358

$10.940

-

-

-

AZTECH Wire

Italy . 798 parts In-Stock

1+ parts

$17.580

100+ parts

-

1k+ parts

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798

$17.580

-

-

-

Microchip USA

USA . 2,148 parts In-Stock

1+ parts

$29.400

100+ parts

-

1k+ parts

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2,148

$29.400

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 29,171 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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29,171

-

-

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Problanco Electronics

Mexico . 7,905 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,905

-

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,500

-

-

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TANS Electronics

Latvia . 5,930 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,930

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-

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SupplyDigital Components

Austria . 5,243 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,243

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Kulean Microsystems

USA . 2,149 parts In-Stock

1+ parts

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100+ parts

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2,149

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UHIMA Technologies

Türkiye . 764 parts In-Stock

1+ parts

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764

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Perfect Parts

USA . 447 parts In-Stock

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447

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Overview

Unlock the power of seamless voltage level translation with Onsemi's MC10H350FNR2G. This cutting-edge chip carrier package boasts 4 functions, operating at a maximum supply voltage of 5.25V with lightning-fast 5ns delay. Ideal for PECL to TTL translation, this innovative solution ensures reliable performance in commercial extended temperature grades. Say goodbye to compatibility issues and hello to effortless signal conversion with the MC10H350FNR2G from Onsemi. Elevate your electronics today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for electronic applications.

Surface Mount: YES

Being surface mountable allows for easy PCB assembly and saves space on the board.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage tolerance provides flexibility and compatibility with various systems.

No. of Functions: 4

Having multiple functions in one device reduces the need for additional components, simplifying the design.

Package Shape: SQUARE

The square package shape is space efficient and fits well within electronic circuits.

Power Supplies (V): 5

Operating at a common 5V power supply simplifies the power management in the system.

No. of Terminals: 20

Having 20 terminals provides ample connection points for interfacing with other components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and suitable for high-density PCB designs.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures compatibility with systems that operate at lower voltage levels.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, the device can withstand challenging environmental conditions.

Output Characteristics: 3-STATE

The 3-state output allows for flexible control of the output signals, enhancing the versatility of the device.

Minimum Operating Temperature: 0 °C

The device can operate in a wide temperature range, making it suitable for various applications.

Terminal Finish: TIN

The use of tin terminal finish provides good conductivity and solderability, ensuring reliable connections.

Terminal Position: QUAD

The quad terminal position facilitates easy PCB layout and connection arrangements.

Maximum Seated Height: 4.57 mm

The low seated height of the device allows for slim and compact electronic designs.

Width: 8.965 mm

The moderate width of the device enables easy placement on the PCB without taking up too much space.

Output Polarity: TRUE

Having true output polarity ensures consistent and accurate signal transmission.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes the risk of thermal damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for lead-free soldering processes.

Length: 8.965 mm

The compact length of the device complements the overall space-saving design.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures reliable performance in extended temperature ranges.

Technology: ECL

Using ECL technology provides high-speed performance and low power consumption.

Terminal Form: J BEND

The J bend terminal form offers mechanical stability and easy insertion during assembly.

Nominal Supply Voltage: 5 V

Operating at the nominal 5V supply voltage ensures compatibility with standard power sources.

Maximum Delay: 5 ns

The low maximum delay ensures fast signal transmission, critical for real-time applications.

Terminal Pitch: 1.27 mm

The fine terminal pitch allows for precise connections and high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates good moisture resistance during storage and assembly.

Interface IC Type: PECL TO TTL TRANSLATOR

The PECL to TTL translator interface IC type allows seamless communication between different logic levels.

Technical Specifications

Voltage Level Translators MC10H350FNR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

5 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10H350FNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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