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TXB0106RGYRG4

Texas Instruments

TXB0106RGYRG4 by Texas Instruments

TXB0106RGYRG4 by Texas Instruments is a voltage level translator with 6 bits and 16 terminals. It operates b/w -40 to 85 °C, with supply voltage ranging from 1.2V to 3.6V. Ideal for applications requiring open-drain output characteristics in compact spaces due to its chip carrier package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,942 parts In-Stock

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3,942

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Digiode

USA . 1,665 parts In-Stock

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1,665

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Nova Conductors

Japan . 52 parts In-Stock

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52

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,448 parts In-Stock

1+ parts

$4.500

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-

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1,448

$4.500

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Parana Technologies

USA . 674 parts In-Stock

1+ parts

$9.147

100+ parts

-

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$9.794

10k+ parts

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674

$9.147

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$9.794

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Andel Nordic

Denmark . 3,535 parts In-Stock

1+ parts

$9.475

100+ parts

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$9.096

10k+ parts

$9.096

3,535

$9.475

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$9.096

$9.096

DigiPath Technology Company

USA . 851 parts In-Stock

1+ parts

$10.071

100+ parts

$9.266

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-

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851

$10.071

$9.266

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ChromeModa Solutions

Germany . 6,928 parts In-Stock

1+ parts

$10.277

100+ parts

$8.427

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6,928

$10.277

$8.427

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IDEA Electronic Components Group

UK . 2,131 parts In-Stock

1+ parts

$10.277

100+ parts

$9.763

1k+ parts

$9.249

10k+ parts

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2,131

$10.277

$9.763

$9.249

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$14.271

100+ parts

$13.557

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$13.557

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500

$14.271

$13.557

$13.557

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AZTECH Wire

Italy . 781 parts In-Stock

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$18.021

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781

$18.021

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One Stop Electronics

USA . 594 parts In-Stock

1+ parts

$27.500

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594

$27.500

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Corohmni

South Africa . 110 parts In-Stock

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$33.966

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110

$33.966

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Semicontronic

India . 353 parts In-Stock

1+ parts

$40.500

100+ parts

$39.488

1k+ parts

$39.285

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353

$40.500

$39.488

$39.285

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Argo Parts USA

USA . 3,524 parts In-Stock

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Corphita

USA . 2,823 parts In-Stock

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2,823

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Continental Prestige Electronics

USA . 2,513 parts In-Stock

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2,513

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Bastille Electronics

Australia . 60 parts In-Stock

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60

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Overview

Upgrade your voltage level translation needs with the TXB0106RGYRG4 by Texas Instruments. This high-quality chip carrier package offers reliable surface mount capabilities and boasts a wide operating temperature range, making it ideal for a variety of applications. With its open-drain output characteristics and low supply current, this voltage level translator provides efficient and seamless signal conversion without compromising performance. Trust in Texas Instruments' reputation for excellence and elevate your electronic designs with the TXB0106RGYRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external factors, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V provides flexibility and compatibility with a wide range of systems and components.

Package Shape: RECTANGULAR

Rectangular package shape is common and easy to work with, allowing for standardized design and installation processes.

No. of Bits: 6

6 bits of data allow for intricate and precise voltage level translation, making the product suitable for complex digital systems.

No. of Terminals: 16

With 16 terminals, this product offers versatile connectivity options, enabling seamless integration into diverse circuit configurations.

Minimum Supply Voltage: 1.2 V

Support for a minimum supply voltage of 1.2V ensures efficient performance even under low power conditions, enhancing overall reliability.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C enables the product to withstand elevated thermal conditions, improving overall durability and performance.

Output Characteristics: OPEN-DRAIN

Open-drain output characteristics offer flexibility in connecting to different types of devices and circuits, enhancing compatibility and functionality.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures reliable operation even in extreme cold environments, expanding the product's usability.

Maximum Seated Height: 1 mm

Slim and compact design with a maximum seated height of 1mm saves space and allows for efficient utilization in tight layouts and designs.

Width: 3.5 mm

Narrow width of 3.5mm facilitates easy placement and integration of the product in compact electronic systems, optimizing layout and design flexibility.

Length: 4 mm

Compact length of 4mm contributes to the overall small form factor of the product, enabling streamlined and space-saving installations.

Maximum Supply Current: 0.005 mA

Low maximum supply current of 0.005mA ensures energy efficiency and minimal power consumption, ideal for battery-operated or low-power applications.

Output Latch/Register: LATCH

Output latch/register feature provides stability and control over data transmission, preventing data loss or corruption in critical operations.

Nominal Supply Voltage: 1.5 V

Nominal supply voltage of 1.5V establishes a standard operating level for the product, promoting compatibility and consistent performance in various setups.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables precise and secure connections, facilitating reliable signal transfer and reducing the risk of electrical interference.

Interface IC Type: VOLTAGE LEVEL TRANSLATOR

Specifically designed as a voltage level translator, this product excels in accurately converting and adapting voltage signals between different logic levels, ensuring seamless communication between incompatible systems.

Technical Specifications

Voltage Level Translators TXB0106RGYRG4 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N16

Length:

4 mm

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Latch/Register:

LATCH

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.14X.16,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Current:

.005 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3.5 mm

Trade Compliance

TXB0106RGYRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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