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MC100EPT26DTR2

Onsemi

MC100EPT26DTR2 by Onsemi

MC100EPT26DTR2 by Onsemi is a voltage level translator with 3.3V power supply, operating from -40 to 85 °C. It features PECL to TTL translation, totum-pole output, and 2.2ns max delay. Ideal for industrial applications requiring precise signal conversion in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,591 parts In-Stock

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Bristol Electronics

USA . 2,500 parts In-Stock

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2,500

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Dan-Mar Components

USA . 2,500 parts In-Stock

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2,500

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Digiode

USA . 422 parts In-Stock

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Semi Source

USA . 98 parts In-Stock

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AZTECH Wire

Italy . 121 parts In-Stock

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$16.060

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SupplyDigital Components

Austria . 8,376 parts In-Stock

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TANS Electronics

Latvia . 7,057 parts In-Stock

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Kulean Microsystems

USA . 6,180 parts In-Stock

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Microchip USA

USA . 5,062 parts In-Stock

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UHIMA Technologies

Türkiye . 619 parts In-Stock

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Problanco Electronics

Mexico . 614 parts In-Stock

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Corphita

USA . 526 parts In-Stock

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Corohmni

South Africa . 240 parts In-Stock

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Overview

Unlock seamless voltage level translation with the MC100EPT26DTR2 by Onsemi, a leading manufacturer known for top-quality components. Ideal for industrial applications, this voltage level translator offers reliable performance and precise signal conversion from PECL to TTL. With a small outline package and dual terminals, this product ensures easy integration and space-saving design. Experience enhanced efficiency and seamless communication between different voltage levels with the MC100EPT26DTR2. Elevate your projects with Onsemi's trusted technology and elevate your performance to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, the product is compatible with a wide range of power sources.

Package Shape: SQUARE

Square package shape provides stability and easy alignment during assembly.

Power Supplies (V): 3.3

Operates on a standard power supply of 3.3V, ensuring compatibility with common electronic systems.

No. of Terminals: 8

Eight terminals provide multiple connection options for versatile integration.

Output Polarity: TRUE

True output polarity ensures accurate signal translation between different voltage levels.

Maximum Delay: 2.2 ns

Fast maximum delay of 2.2 ns ensures quick signal processing for efficient operation.

Technical Specifications

Voltage Level Translators MC100EPT26DTR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.2 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

MC100EPT26DTR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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