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SN10KHT5562DW

Texas Instruments

SN10KHT5562DW by Texas Instruments

SN10KHT5562DW by Texas Instruments is an 8-function voltage level translator with a package style of small outline. It operates b/w 0°C to 75°C, featuring ECL technology and a terminal pitch of 1.27mm. Ideal for TTL to ECL transceiver applications due to its true output polarity and 3-STATE output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,176 parts In-Stock

1+ parts

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8,176

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Digiode

USA . 4,316 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,316

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,755 parts In-Stock

1+ parts

$5.649

100+ parts

-

1k+ parts

$6.445

10k+ parts

-

1,755

$5.649

-

$6.445

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ChromeModa Solutions

Germany . 4,258 parts In-Stock

1+ parts

$6.347

100+ parts

$5.205

1k+ parts

-

10k+ parts

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4,258

$6.347

$5.205

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IDEA Electronic Components Group

UK . 427 parts In-Stock

1+ parts

$6.347

100+ parts

-

1k+ parts

$5.712

10k+ parts

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427

$6.347

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$5.712

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AZTECH Wire

Italy . 773 parts In-Stock

1+ parts

$19.275

100+ parts

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773

$19.275

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One Stop Electronics

USA . 1,614 parts In-Stock

1+ parts

$25.500

100+ parts

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1k+ parts

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1,614

$25.500

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Corphita

USA . 1,737 parts In-Stock

1+ parts

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100+ parts

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1,737

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DigiPath Technology Company

USA . 254 parts In-Stock

1+ parts

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100+ parts

$5.722

1k+ parts

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10k+ parts

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254

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$5.722

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Overview

Upgrade your voltage level translation needs with the SN10KHT5562DW by Texas Instruments. This high-quality product offers customers a reliable solution for their applications in various industries. With its innovative design and advanced technology, this voltage level translator provides exceptional performance and efficiency. Whether you're working on telecommunications, industrial control systems, or consumer electronics, this versatile component ensures seamless signal conversion. Trust Texas Instruments for cutting-edge solutions that deliver value and reliability every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort in production.

No. of Functions: 8

Having 8 functions adds versatility to the product, allowing it to perform multiple tasks efficiently in a single component.

Package Shape: RECTANGULAR

Rectangular shape helps in efficient space utilization and easy integration into circuit designs.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options, enabling compatibility with a wide range of devices and systems.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, enabling compact and sleek designs.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, the product can withstand heat and function reliably in demanding conditions.

Output Characteristics: 3-STATE

3-State output characteristics offer flexibility in controlling signals, enabling efficient signal management in different scenarios.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the product can function effectively in colder environments without any performance issues.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved connectivity, enhancing overall reliability of the product.

Maximum Seated Height: 2.65 mm

Low maximum seated height allows for compact installations, suitable for applications where space is limited.

Width: 7.5 mm

Narrow width facilitates easy placement on circuit boards, accommodating densely packed designs.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and compatibility with various systems that require a specific polarity.

Length: 15.4 mm

Moderate length provides a balance between compactness and flexibility in installation, making the product versatile for different layout requirements.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures stable performance in both standard and slightly elevated temperature conditions, making it suitable for a wide range of applications.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, ideal for applications requiring efficient data processing and transmission.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections and ease of assembly, enhancing the durability and reliability of the product.

Maximum Delay: 0 ns

Zero maximum delay ensures minimal signal propagation time, enabling fast and efficient data transmission without any delays.

Terminal Pitch: 1.27 mm

Narrow terminal pitch allows for high-density mounting, optimizing board space and facilitating compact circuit designs.

Interface IC Type: TTL TO ECL TRANSCEIVER

TTL to ECL transceiver interface IC type offers seamless integration with various systems using different logic levels, enhancing compatibility and versatility.

Technical Specifications

Voltage Level Translators SN10KHT5562DW attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

0 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SN10KHT5562DW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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