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SN10KHT5543DWRE4

Texas Instruments

SN10KHT5543DWRE4 by Texas Instruments

SN10KHT5543DWRE4 by Texas Instruments is a voltage level translator with 8 functions, operating at supply voltages of 4.5V to 5.5V. It features an interface IC type of TTL to ECL Translator and has a max delay of 3.3ns. This device is ideal for applications requiring precise signal translation in commercial extended temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,055 parts In-Stock

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4,055

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Digiode

USA . 382 parts In-Stock

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382

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 310 parts In-Stock

1+ parts

$5.386

100+ parts

-

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$6.069

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310

$5.386

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$6.069

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DigiPath Technology Company

USA . 756 parts In-Stock

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$5.931

100+ parts

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756

$5.931

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ChromeModa Solutions

Germany . 5,844 parts In-Stock

1+ parts

$6.052

100+ parts

$4.963

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5,844

$6.052

$4.963

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IDEA Electronic Components Group

UK . 865 parts In-Stock

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$6.052

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$5.447

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865

$6.052

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$5.447

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AZTECH Wire

Italy . 609 parts In-Stock

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$9.365

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609

$9.365

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One Stop Electronics

USA . 889 parts In-Stock

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$24.500

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889

$24.500

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Microchip USA

USA . 3,743 parts In-Stock

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Corphita

USA . 915 parts In-Stock

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Overview

Elevate your voltage level translation with the SN10KHT5543DWRE4 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments brings you a voltage level translator that boasts 8 functions in a small outline package. Perfect for applications requiring precise signal conversion, this device offers true output polarity and minimal delay of 3.3 ns, ensuring seamless data transmission. With a maximum supply voltage of 5.5 V and a wide operating temperature range, the SN10KHT5543DWRE4 provides unmatched value and performance for your electronic projects. Experience the benefits of cutting-edge technology with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components.

Surface Mount: YES

Allows for easy installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs for versatility in applications.

No. of Functions: 8

Provides multiple logical operations in a single device for efficient circuit design.

Package Shape: RECTANGULAR

Easily fits into standard circuit board designs.

Power Supplies (V): 5,-5.2

Offers both positive and negative supply voltages for compatibility with different systems.

No. of Terminals: 24

Provides multiple connection points for diverse circuit configurations.

Package Style (Meter): SMALL OUTLINE

Space-saving design suitable for compact electronic devices.

Minimum Supply Voltage: 4.5 V

Works reliably even at lower voltage inputs.

Maximum Operating Temperature: 75 °C

Can operate effectively in a wide range of temperature environments.

Output Characteristics: OPEN-EMITTER

Allows for flexibility in output signal connections.

Minimum Operating Temperature: 0 °C

Suitable for use in various temperature conditions.

Terminal Position: DUAL

Facilitates easy connections for input and output signals.

Maximum Seated Height: 2.65 mm

Low profile design for compact circuit layouts.

Width: 7.5 mm

Compact size for space-constrained applications.

Output Polarity: TRUE

Ensures correct signal polarity for accurate data transmission.

Length: 15.4 mm

Optimal size for fitting into standard circuit board layouts.

Temperature Grade: COMMERCIAL EXTENDED

Meets industry standards for temperature performance.

Technology: BIPOLAR

Utilizes bipolar technology for reliable signal processing.

Terminal Form: GULL WING

Facilitates easy soldering onto circuit boards.

Maximum Supply Current: 25 mA

Can safely handle current requirements of connected devices.

Input Characteristics: STANDARD

Compatible with conventional input signal levels.

Nominal Supply Voltage: 5 V

Standard supply voltage suitable for most electronic systems.

Nominal Negative Supply Voltage: -5.2 V

Provides stable negative voltage supply for specific applications.

Maximum Delay: 3.3 ns

Fast signal processing for rapid data transmission.

Terminal Pitch: 1.27 mm

Optimal spacing for easy connections on circuit boards.

Interface IC Type: TTL TO ECL TRANSLATOR

Ideal for translating signal levels between different logic families.

Technical Specifications

Voltage Level Translators SN10KHT5543DWRE4 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

3.3 ns

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Level Translators

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN10KHT5543DWRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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