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TXB0101DBVRG4

Texas Instruments

TXB0101DBVRG4 by Texas Instruments

TXB0101DBVRG4 by Texas Instruments is a voltage level translator with max supply voltage of 3.6V, min supply voltage of 1.2V, and operating temperature range from -40 to 85°C. It has 6 terminals in a small outline package style for industrial applications requiring open-drain output characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,711 parts In-Stock

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3,711

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Semi Source

USA . 1,747 parts In-Stock

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1,747

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Vyrian

USA . 1,473 parts In-Stock

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1,473

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Parana Technologies

USA . 2,097 parts In-Stock

1+ parts

$2.590

100+ parts

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$3.081

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2,097

$2.590

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$3.081

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DigiPath Technology Company

USA . 1,912 parts In-Stock

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$2.852

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1,912

$2.852

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ChromeModa Solutions

Germany . 1,356 parts In-Stock

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$2.910

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$2.386

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$2.910

$2.386

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IDEA Electronic Components Group

UK . 7 parts In-Stock

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$2.910

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$2.619

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7

$2.910

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$2.619

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Corohmni

South Africa . 58 parts In-Stock

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$10.992

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58

$10.992

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AZTECH Wire

Italy . 363 parts In-Stock

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$13.889

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363

$13.889

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Ampacity Inc.

Singapore . 1,288 parts In-Stock

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$22.500

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$22.500

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One Stop Electronics

USA . 1,264 parts In-Stock

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$49.500

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$49.500

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Continental Prestige Electronics

USA . 4,379 parts In-Stock

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Corphita

USA . 4,052 parts In-Stock

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Argo Parts USA

USA . 2,164 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Advanced Electronics

New Zealand . 200 parts In-Stock

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200

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Overview

Elevate your electronic designs with the TXB0101DBVRG4 by Texas Instruments, a top-tier manufacturer known for quality and reliability. As a voltage level translator, this versatile component opens up a world of possibilities for seamless communication between different voltage domains. With its compact design and industrial-grade temperature range, the TXB0101DBVRG4 offers unparalleled performance and efficiency. Say goodbye to compatibility issues and hello to smooth operation – upgrade to the TXB0101DBVRG4 today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the voltage level translator.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Allows for reliable operation within a range of voltage inputs, accommodating various system requirements.

Package Shape: RECTANGULAR

Rectangular shape enables easy integration into existing circuit layouts and designs.

Power Supplies (V): 1.2/3.6,1.8/5

Supports multiple power supply options, providing flexibility for different voltage requirements in a system.

No. of Terminals: 6

Having 6 terminals provides connectivity for input and output signals, ensuring efficient signal translation.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact and low-profile package style saves space on the circuit board and minimizes signal interference.

Minimum Supply Voltage: 1.2 V

Can operate with low supply voltages, making it suitable for low-power applications.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable performance in various environmental conditions.

Output Characteristics: OPEN-DRAIN

Open-drain output allows for easy interfacing with other components and devices in the system.

Minimum Operating Temperature: -40 °C

Wide temperature range supports operation in cold environments, making it suitable for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish ensures connectivity and signal integrity over long-term use.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures signal stability.

Maximum Seated Height: 1.45 mm

Low seated height saves space and allows for compact design integration.

Width: 1.6 mm

Narrow width enables placement in tight spaces on the circuit board, optimizing board real estate.

Maximum Time At Peak Reflow Temperature (s): 30

30-second peak reflow time ensures proper soldering and component integration during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures solder joints meet industry standards for reliability.

Length: 2.9 mm

Compact length allows for flexible placement on the circuit board without sacrificing performance.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and secure attachment to the circuit board.

Output Latch/Register: LATCH

Latch output feature holds the last valid signal state, preventing signal loss in case of power disruptions.

Nominal Supply Voltage: 1.5 V

Nominal supply voltage ensures stable operation and compatibility with most common voltage levels.

Terminal Pitch: 0.95 mm

Narrow terminal pitch allows for fine-pitch integration on the circuit board, optimizing signal routing.

Interface IC Type: VOLTAGE LEVEL TRANSLATOR

Designed specifically for voltage level translation applications, providing reliable and accurate signal conversion.

Technical Specifications

Voltage Level Translators TXB0101DBVRG4 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Latch/Register:

LATCH

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.6,1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

TXB0101DBVRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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