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MC100ELT24DG

Onsemi

MC100ELT24DG by Onsemi

MC100ELT24DG by Onsemi is a voltage level translator with TTL to ECL interface. It operates b/w -40 to 85 °C, translating signals with 2ns delay. With small outline package and gull wing terminals, it's ideal for industrial applications requiring complementary output polarity.

Median Price

$19.690

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 519 parts In-Stock

1+ parts

$19.690

100+ parts

$18.510

1k+ parts

$17.330

10k+ parts

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519

$19.690

$18.510

$17.330

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Distributors (In-Stock)

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Digiode

USA . 1,556 parts In-Stock

1+ parts

$19.788

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1,556

$19.788

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Vyrian

USA . 8,778 parts In-Stock

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8,778

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Chip Stock

USA . 134 parts In-Stock

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134

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Prism Electronics

USA . 18 parts In-Stock

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18

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AZTECH Wire

Italy . 1,014 parts In-Stock

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$17.710

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1,014

$17.710

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Corphita

USA . 1,373 parts In-Stock

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$18.747

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1,373

$18.747

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Corohmni

South Africa . 388 parts In-Stock

1+ parts

$20.830

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388

$20.830

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Microchip USA

USA . 7,735 parts In-Stock

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7,735

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Problanco Electronics

Mexico . 6,108 parts In-Stock

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6,108

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Kulean Microsystems

USA . 5,677 parts In-Stock

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5,677

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TANS Electronics

Latvia . 1,821 parts In-Stock

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1,821

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SupplyDigital Components

Austria . 1,776 parts In-Stock

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1,776

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UHIMA Technologies

Türkiye . 382 parts In-Stock

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382

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Perfect Parts

USA . 293 parts In-Stock

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Kepictronics

USA . 85 parts In-Stock

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Overview

Upgrade your voltage level translation with the MC100ELT24DG by Onsemi. Designed with precision and reliability in mind, this versatile small outline package offers seamless integration into a wide range of applications. From TTL to ECL translation, this industrial-grade technology provides fast signal conversion with minimal delay, ensuring optimal performance in your circuits. Trust in Onsemi's reputation for quality and innovation, and experience the value and benefits that the MC100ELT24DG brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring longevity of the product.

Surface Mount: YES

Enables easy integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

Supports a wide range of voltage levels, making it versatile for various applications.

Package Shape: RECTANGULAR

Allows for easy placement and alignment within a circuit layout.

Power Supplies (V): 5,-4.5/-5.2

Offers flexibility in power supply options, accommodating different voltage requirements.

No. of Terminals: 8

Provides ample connection points for interfacing with other components.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on the circuit board, ideal for applications with size constraints.

Minimum Supply Voltage: 4.5 V

Ensures reliable operation even at lower voltage levels, enhancing the product's reliability.

Maximum Operating Temperature: 85 °C

Capable of operating efficiently in high-temperature environments, increasing the product's reliability and versatility.

Output Characteristics: OPEN-EMITTER

Provides flexibility in signal output configurations, allowing for customization based on application requirements.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature conditions without compromising performance, suitable for a wide range of applications.

Terminal Finish: TIN

Offers corrosion resistance and excellent solderability, ensuring secure connections and long-term reliability.

Terminal Position: DUAL

Allows for versatile mounting orientations, accommodating different layout requirements in the circuit design.

Maximum Seated Height: 1.75 mm

Low profile design enables easy integration into compact electronic devices, saving space.

Width: 3.9 mm

Compact width allows for efficient use of board space, ideal for densely populated circuit layouts.

Output Polarity: COMPLEMENTARY

Supports bidirectional signal conversion, enabling versatile signal processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures efficient and reliable soldering during the assembly process, reducing the risk of thermal damage.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes, ensuring secure connections and long-term reliability.

Length: 4.9 mm

Compact length facilitates easy placement on the circuit board, optimizing space utilization.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation in demanding conditions.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed and low-power operation, ideal for high-performance applications.

Terminal Form: GULL WING

Facilitates easy and secure soldering onto the circuit board, ensuring reliable connections.

Nominal Supply Voltage: 5 V

Provides a standard voltage level for seamless integration into existing electronics systems.

Nominal Negative Supply Voltage: -5 V

Supports dual power supply configurations, enabling compatibility with a wide range of electronic systems.

Maximum Delay: 2 ns

Offers fast signal processing capabilities, essential for high-speed applications requiring minimal latency.

Terminal Pitch: 1.27 mm

Optimal terminal spacing for easy assembly and soldering, ensuring efficient and reliable connections.

Interface IC Type: TTL TO ECL TRANSLATOR

Facilitates seamless communication between TTL and ECL logic circuits, enabling interoperability between different signal standards.

Technical Specifications

Voltage Level Translators MC100ELT24DG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-4.5/-5.2

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100ELT24DG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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