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MC10ELT25DR2G

Onsemi

MC10ELT25DR2G by Onsemi

MC10ELT25DR2G by Onsemi is a voltage level translator with 8 terminals and ECL technology. It operates b/w -40 to 85 °C, translating ECL to TTL signals with a delay of 4.1 ns. Ideal for industrial applications requiring precise signal translation in compact spaces.

Median Price

$2.600

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2,848 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.700

2,848

-

-

-

$2.700

Rochester

USA . 1,523 parts In-Stock

1+ parts

-

100+ parts

$2.190

1k+ parts

$1.960

10k+ parts

$1.850

1,523

-

$2.190

$1.960

$1.850

Verical

USA . 880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.600

10k+ parts

-

880

-

-

$2.600

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 414 parts In-Stock

1+ parts

$2.318

100+ parts

-

1k+ parts

-

10k+ parts

-

414

$2.318

-

-

-

Vyrian

USA . 2,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,615

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,067 parts In-Stock

1+ parts

$2.196

100+ parts

-

1k+ parts

-

10k+ parts

-

2,067

$2.196

-

-

-

Corohmni

South Africa . 155 parts In-Stock

1+ parts

$2.440

100+ parts

-

1k+ parts

-

10k+ parts

-

155

$2.440

-

-

-

AZTECH Wire

Italy . 253 parts In-Stock

1+ parts

$15.720

100+ parts

-

1k+ parts

-

10k+ parts

-

253

$15.720

-

-

-

Problanco Electronics

Mexico . 7,343 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

7,343

-

-

-

-

Continental Prestige Electronics

USA . 2,848 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.700

10k+ parts

-

2,848

-

-

$2.700

-

Kulean Microsystems

USA . 2,498 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,498

-

-

-

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UHIMA Technologies

Türkiye . 683 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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683

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-

-

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SupplyDigital Components

Austria . 540 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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540

-

-

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TANS Electronics

Latvia . 464 parts In-Stock

1+ parts

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100+ parts

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464

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Kepictronics

USA . 340 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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340

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-

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Microchip USA

USA . 338 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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338

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Overview

Unlock the power of seamless voltage level translation with the MC10ELT25DR2G by Onsemi. Crafted with precision and expertise, this voltage translator offers unparalleled performance and reliability in a compact package. Ideal for industrial applications, this device ensures smooth signal transmission between different voltage domains, making it a must-have for any electronics enthusiast. Experience the quality and innovation that Onsemi is known for, and elevate your projects to new heights with the MC10ELT25DR2G. Upgrade your circuits today and discover the difference with Onsemi!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient soldering onto PCBs, saving space and increasing assembly efficiency.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V ensures compatibility with a wide range of systems and devices.

Package Shape: RECTANGULAR

Rectangular shape makes the package easy to handle and integrate into circuit designs.

Power Supplies (V): 5

Operating at a power supply of 5V makes it compatible with many standard electronic systems.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity and functionality for various applications.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5V ensures efficient operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product can withstand harsh environmental conditions.

Output Characteristics: TOTEM-POLE

Totem-pole output characteristics provide strong and reliable signal transmission capabilities.

Minimum Operating Temperature: -40 °C

The product can operate in extremely cold temperatures down to -40 °C, suitable for industrial and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout and connections.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a compact overall design in space-constrained applications.

Width: 3.9 mm

Narrow width of 3.9mm enables the product to be used in tight spaces or densely populated PCBs.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission without any inversion issues.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for up to 30 seconds, enabling reliable soldering during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the product can undergo high-temperature soldering processes without damage.

Length: 4.9 mm

Compact length of 4.9mm allows for space-efficient placement on PCBs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in challenging operating environments.

Technology: ECL

Utilizing ECL technology means high-speed and low-power consumption capabilities, suitable for demanding applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy surface mounting and soldering, enhancing manufacturing efficiency.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard electronic systems and components.

Nominal Negative Supply Voltage: -5 V

Having a nominal negative supply voltage of -5V allows for dual-power supply operation, increasing flexibility in system design.

Maximum Delay: 4.1 ns

With a maximum delay of 4.1ns, the product provides fast signal translation and processing for efficient operation.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch enables easy connection and integration into standard PCB layouts.

Interface IC Type: ECL TO TTL TRANSLATOR

The ECL to TTL translator interface IC type allows for seamless communication and signal conversion between different logic levels.

Technical Specifications

Voltage Level Translators MC10ELT25DR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

4.1 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10ELT25DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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