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MC100LVELT23D

Onsemi

MC100LVELT23D by Onsemi

MC100LVELT23D by Onsemi is a voltage level translator with 2 functions, operating at 3.3V. It has a max supply voltage of 3.8V and output polarity is TRUE. Ideal for PECL to TTL translation in industrial applications due to its ECL technology and totem-pole output characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Legend Electronics Inc.

USA . 1,697 parts In-Stock

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Vyrian

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Digiode

USA . 601 parts In-Stock

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Cyclops Electronics Ltd

UK . 378 parts In-Stock

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Prism Electronics

USA . 334 parts In-Stock

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Bristol Electronics

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LWI Electronics Inc

India . 98 parts In-Stock

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Electronic Expediters

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Quantum Digital Technology

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Inventory MP

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Sunrise Surplus Inc.

USA . 51 parts In-Stock

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PC Components Company LLC

USA . 50 parts In-Stock

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R&J Components

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Semi Source

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Sea View Technologies

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A2Z Electronics, Inc.

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Inland Empire Components Inc.

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Component Stockers USA

USA . 3,931 parts In-Stock

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$1.050

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$0.990

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$0.960

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Ampacity Inc.

Singapore . 1,144 parts In-Stock

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$37.500

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RC Electronics

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TANS Electronics

Latvia . 7,514 parts In-Stock

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SupplyDigital Components

Austria . 6,380 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 911 parts In-Stock

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Corphita

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Corohmni

South Africa . 404 parts In-Stock

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Kepictronics

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Perfect Parts

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Overview

Experience seamless voltage level translation with the MC100LVELT23D by Onsemi. This cutting-edge product boasts top-notch quality and reliability, thanks to its manufacturer's reputation for excellence. Ideal for a wide range of applications, this voltage translator offers unparalleled value to customers looking for efficient and precise signal processing. Say goodbye to compatibility issues and hello to smooth operations with the MC100LVELT23D.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the internal components of the voltage level translator.

Maximum Supply Voltage: 3.8 V

Can handle high input voltages without risk of damage, making it suitable for a variety of applications.

No. of Functions: 2

Provides flexibility and capability to translate between two different voltage levels, enhancing compatibility.

Output Characteristics: TOTEM-POLE

Delivers strong and reliable output signals for seamless data transmission.

Terminal Finish: TIN LEAD

Ensures good electrical conductivity and solderability for easy integration into circuits.

Maximum Delay: 2.5 ns

Offers fast signal translation with minimal delay, improving overall system performance.

Technical Specifications

Voltage Level Translators MC100LVELT23D attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.5 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC100LVELT23D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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