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MC10124L

Onsemi

MC10124L by Onsemi

MC10124L by Onsemi is a voltage level translator with 4 functions, operating at 5V and -5.2V. It has a max delay of 6ns, suitable for TTL to ECL translation applications due to its ECL10K technology and complementary output polarity.

Median Price

$5.775

Lifecycle Status

Suppliers In-Stock

53

In-Stock Inventory

1k+

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Rochester

USA . 11,862 parts In-Stock

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DigiKey

USA . 11,862 parts In-Stock

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Digiode

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Vyrian

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Freelance Electronics

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Bristol Electronics

USA . 540 parts In-Stock

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Corphita

USA . 1,590 parts In-Stock

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$5.004

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Corohmni

South Africa . 185 parts In-Stock

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MARBEL Systems

Belgium . 3,205 parts In-Stock

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$7.790

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Texas Native Microelectronics

USA . 300 parts In-Stock

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$8.954

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$8.596

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$8.327

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$7.880

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$8.596

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$7.880

Kenton Components

USA . 3,960 parts In-Stock

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$10.745

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$9.455

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Qasali Group International

UK . 1,926 parts In-Stock

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$24.176

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$22.483

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$21.275

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$22.483

$21.275

QUARKTWIN TECHNOLOGY LTD

USA . 26,935 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 8,337 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 4,845 parts In-Stock

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Latvia . 4,246 parts In-Stock

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SupplyDigital Components

Austria . 2,991 parts In-Stock

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Kepictronics

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Metaverse IC Inc.

Canada . 950 parts In-Stock

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UHIMA Technologies

Türkiye . 534 parts In-Stock

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Overview

Upgrade your voltage level translation with the MC10124L by Onsemi. Crafted with precision in a ceramic, glass-sealed package, this versatile device offers 4 functions in a compact rectangular shape. Trust in Onsemi's reputation for manufacturing excellence as you experience seamless translation from TTL to ECL signals. From industrial automation to telecommunications, this innovative translator ensures reliable performance and compatibility across various applications. Elevate your projects with the MC10124L and unlock new possibilities in signal processing.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and reliability for long-term use.

No. of Functions: 4

Having 4 functions in one device makes it versatile and capable of handling multiple voltage translation tasks efficiently.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various circuit designs and layouts.

Power Supplies (V): 5,-5.2

Supporting power supplies of 5V and -5.2V enables compatibility with a wide range of electronic devices and systems.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options and flexibility for different wiring configurations.

Package Style (Meter): IN-LINE

The in-line package style allows for space-efficient mounting and easy connection in crowded circuit boards.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures stable performance even in harsh environmental conditions.

Output Characteristics: OPEN-EMITTER

The open-emitter output characteristics provide flexibility in connecting to various components and circuits.

Minimum Operating Temperature: -30 °C

With a low minimum operating temperature of -30°C, this product can function reliably even in cold environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good solderability and electrical conductivity for secure connections.

Terminal Position: DUAL

The dual terminal position allows for easy installation and connection in different orientations.

Maximum Seated Height: 5.08 mm

The low maximum seated height of 5.08 mm enables compact and space-saving designs.

Width: 7.62 mm

The compact width of 7.62 mm facilitates easy integration into tight spaces and small circuit layouts.

Output Polarity: COMPLEMENTARY

The complementary output polarity ensures compatibility with a wide range of devices and systems.

Length: 19.495 mm

The moderate length of 19.495 mm provides a balance between space efficiency and functionality.

Technology: ECL10K

The ECL10K technology offers high-speed performance and reliable voltage translation capabilities.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and stable mounting on circuit boards for long-term use.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard electronic devices and power sources.

Nominal Negative Supply Voltage: -5.2 V

Supporting a nominal negative supply voltage of -5.2V allows for proper signal conversion and translation in different systems.

Maximum Delay: 6 ns

With a maximum delay of 6 nanoseconds, this product offers fast response times for efficient voltage translation.

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54 mm enables easy connections and compatibility with standard spacing in circuit layouts.

Interface IC Type: TTL TO ECL TRANSLATOR

As a TTL to ECL translator, this product facilitates seamless communication and signal conversion between different logic levels.

Technical Specifications

Voltage Level Translators MC10124L attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

6 ns

Interface IC Type:

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.495 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Level Translators

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

ECL10K

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC10124L Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-101-2392, 5962011012392, 5962-00-588-8334, 5962005888334

NIIN

011012392, 005888334

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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