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MC100H604FNG

Onsemi

MC100H604FNG by Onsemi

MC100H604FNG by Onsemi is a voltage level translator with 6 functions, operating at 4.5-5.5V supply range. It features TTL to ECL translation, 4ns max delay, and open-emitter output characteristics. Ideal for applications requiring high-speed signal conversion in compact spaces.

Median Price

$15.363

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,254 parts In-Stock

1+ parts

-

100+ parts

$12.290

1k+ parts

$11.000

10k+ parts

$10.350

1,254

-

$12.290

$11.000

$10.350

DigiKey

USA . 1,254 parts In-Stock

1+ parts

-

100+ parts

$16.180

1k+ parts

-

10k+ parts

-

1,254

-

$16.180

-

-

Verical

USA . 810 parts In-Stock

1+ parts

-

100+ parts

$15.363

1k+ parts

$13.750

10k+ parts

$12.938

810

-

$15.363

$13.750

$12.938

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,507 parts In-Stock

1+ parts

$13.006

100+ parts

-

1k+ parts

-

10k+ parts

-

1,507

$13.006

-

-

-

Vyrian

USA . 4,152 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,152

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 932 parts In-Stock

1+ parts

$11.870

100+ parts

-

1k+ parts

-

10k+ parts

-

932

$11.870

-

-

-

Corohmni

South Africa . 115 parts In-Stock

1+ parts

$12.030

100+ parts

-

1k+ parts

-

10k+ parts

-

115

$12.030

-

-

-

Corphita

USA . 2,234 parts In-Stock

1+ parts

$12.321

100+ parts

-

1k+ parts

-

10k+ parts

-

2,234

$12.321

-

-

-

TANS Electronics

Latvia . 6,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,320

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

SupplyDigital Components

Austria . 3,457 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,457

-

-

-

-

Problanco Electronics

Mexico . 1,477 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,477

-

-

-

-

Kulean Microsystems

USA . 1,262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,262

-

-

-

-

Continental Prestige Electronics

USA . 1,254 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,254

-

-

-

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Kepictronics

USA . 1,254 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,254

-

-

-

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UHIMA Technologies

Türkiye . 755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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755

-

-

-

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Microchip USA

USA . 280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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280

-

-

-

-

Overview

Unlock new possibilities with the MC100H604FNG by Onsemi. As a leading manufacturer in voltage level translators, Onsemi delivers top-notch quality and reliability. This versatile chip carrier package offers 6 functions and a wide operating temperature range, making it ideal for a variety of applications. Experience seamless integration and improved performance with this innovative solution that provides exceptional value and benefits to customers. Elevate your projects with the MC100H604FNG and discover the difference Onsemi can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Ease of installation and space-saving design due to surface mount option.

Maximum Supply Voltage: 5.5 V

Supports a high maximum supply voltage for versatility in different applications.

No. of Functions: 6

Provides multiple functions in a single device, offering efficiency in circuit design.

Package Shape: SQUARE

Square package shape allows for easy and compact placement on circuit boards.

Power Supplies (V): 5,-5.2

Supports multiple power supplies for flexible voltage requirements.

No. of Terminals: 28

Ample terminals for connecting various components in the circuit.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers high thermal conductivity for efficient heat dissipation.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage allows for operation in energy-efficient applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range for reliability in different environments.

Output Characteristics: OPEN-EMITTER

Open-emitter output provides flexibility in connecting to different types of circuits.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature conditions without performance issues.

Terminal Finish: TIN

Tin terminal finish for enhanced conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position for convenient soldering and connection of components.

Maximum Seated Height: 4.57 mm

Low seated height for space-saving installation in compact devices.

Width: 11.505 mm

Compact width for easy integration into circuit layouts.

Output Polarity: COMPLEMENTARY

Complementary output polarity for efficient signal transmission between different systems.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable soldering during assembly.

Length: 11.505 mm

Optimal length for fitting into standard circuit board designs.

Technology: ECL

ECL technology for high-speed and low-power consumption operation.

Terminal Form: J BEND

J bend terminal form for easy connection and handling during installation.

Output Latch/Register: REGISTER

Output latch/register feature for storing and retaining data in the circuit.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with common power sources.

Maximum Delay: 4 ns

Low maximum delay for fast signal processing and response times.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy connection and compatibility with various components.

Interface IC Type: TTL TO ECL TRANSLATOR

Specific interface IC type for translating signals between TTL and ECL systems.

Technical Specifications

Voltage Level Translators MC100H604FNG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

4 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

REGISTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100H604FNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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