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NLV14504BDG

Onsemi

NLV14504BDG by Onsemi

NLV14504BDG by Onsemi is a voltage level translator with 6 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 3-18 V and max delay of 550 ns. Ideal for military-grade applications requiring TTL/CMOS to CMOS translation in compact spaces.

Median Price

$1.080

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 14,400 parts In-Stock

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Rochester

USA . 7,116 parts In-Stock

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$1.080

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$0.896

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$0.799

7,116

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$1.080

$0.896

$0.799

DigiKey

USA . 7,116 parts In-Stock

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$0.920

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$0.920

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Verical

USA . 4,338 parts In-Stock

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$1.121

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$0.999

4,338

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$1.121

$0.999

Distributors (In-Stock)

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Digiode

USA . 1,713 parts In-Stock

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$0.838

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$0.838

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Vyrian

USA . 1,332 parts In-Stock

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$0.882

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Flip Electronics

USA . 14,400 parts In-Stock

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14,400

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Distributors (Availability)

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Corphita

USA . 1,201 parts In-Stock

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$0.794

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$0.794

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Corohmni

South Africa . 65 parts In-Stock

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$0.882

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65

$0.882

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Vigor

Singapore . 555 parts In-Stock

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$1.890

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555

$1.890

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Continental Prestige Electronics

USA . 7,116 parts In-Stock

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$0.781

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TANS Electronics

Latvia . 7,065 parts In-Stock

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SupplyDigital Components

Austria . 6,584 parts In-Stock

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Problanco Electronics

Mexico . 3,590 parts In-Stock

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Kulean Microsystems

USA . 3,553 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 292 parts In-Stock

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Overview

Unlock seamless voltage level translation with the NLV14504BDG by Onsemi. Manufactured with precision and expertise, this small outline package offers 6 functions, making it ideal for a wide range of applications. From industrial to automotive, this AEC-Q100 screened device ensures reliable performance in extreme conditions. With a maximum supply voltage of 18V and true output polarity, customers can trust in the quality and value that Onsemi delivers. Elevate your projects with the NLV14504BDG and experience superior voltage translation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to external elements, ensuring long-term reliability.

Maximum Supply Voltage: 18 V

Supports a maximum supply voltage of 18 V, making it suitable for a wide range of applications that require higher voltage levels.

Minimum Supply Voltage: 3 V

With a minimum supply voltage of 3 V, this product can also operate efficiently at lower power levels, providing flexibility in usage.

Maximum Operating Temperature: 125 °C

Capable of withstanding high temperatures up to 125 °C, ensuring reliable performance even in challenging thermal conditions.

Technology: CMOS

Utilizes CMOS technology, known for its low power consumption and high noise immunity, leading to efficient operation and reliable signal processing.

Nominal Supply Voltage: 5 V

Operates at a nominal supply voltage of 5 V, suitable for many standard electronic applications, providing compatibility and ease of integration.

Technical Specifications

Voltage Level Translators NLV14504BDG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

550 ns

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

6 mA

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV14504BDG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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