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SN65LVP18DRFTG4

Texas Instruments

SN65LVP18DRFTG4 by Texas Instruments

SN65LVP18DRFTG4 by Texas Instruments is a voltage level translator with 2.5/3.3V power supplies, PECL to LVDS interface IC type, and 0.63ns max delay. It is used in industrial applications for translating signals b/w different voltage levels efficiently and accurately.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,676 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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6,676

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Digiode

USA . 2,117 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,117

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,393 parts In-Stock

1+ parts

$7.707

100+ parts

-

1k+ parts

$8.237

10k+ parts

-

1,393

$7.707

-

$8.237

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ChromeModa Solutions

Germany . 4,247 parts In-Stock

1+ parts

$8.660

100+ parts

$7.101

1k+ parts

-

10k+ parts

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4,247

$8.660

$7.101

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IDEA Electronic Components Group

UK . 2,152 parts In-Stock

1+ parts

$8.660

100+ parts

$8.227

1k+ parts

$7.794

10k+ parts

-

2,152

$8.660

$8.227

$7.794

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One Stop Electronics

USA . 1,646 parts In-Stock

1+ parts

$17.500

100+ parts

-

1k+ parts

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1,646

$17.500

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AZTECH Wire

Italy . 544 parts In-Stock

1+ parts

$19.378

100+ parts

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544

$19.378

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DigiPath Technology Company

USA . 2,262 parts In-Stock

1+ parts

-

100+ parts

$7.808

1k+ parts

-

10k+ parts

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2,262

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$7.808

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Corphita

USA . 1,680 parts In-Stock

1+ parts

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1,680

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Overview

Enhance your electronic designs with the SN65LVP18DRFTG4 by Texas Instruments, a top-tier manufacturer known for delivering high-quality voltage level translators. This versatile component is perfect for a wide range of applications, offering seamless voltage translation for your projects. With its advanced technology and reliable performance, this product ensures efficient signal processing and optimal functionality. Elevate your creations with the value and benefits that the SN65LVP18DRFTG4 provides, making it a must-have for any electronics enthusiast.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while also ensuring longevity.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage capability provides flexibility and compatibility with a wide range of systems and devices.

Package Shape: SQUARE

The square package shape offers a compact design and efficient use of space on the circuit board.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows for integration into systems with different power requirements without the need for additional components.

No. of Terminals: 8

The adequate number of terminals ensures all necessary connections can be made for proper functionality and signal transmission.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style offers thermal efficiency, high performance, and space-saving advantages for compact devices.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage capability ensures compatibility with a wide range of systems and devices without the risk of overvoltage.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in various environmental conditions without the risk of overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature capability ensures the product can function effectively even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish offers excellent conductivity, corrosion resistance, and durability for long-lasting and reliable connections.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility for different wiring configurations, ensuring signal integrity and reliability.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for a compact design and efficient use of space on the circuit board.

Width: 2 mm

The compact width of the product enables easier integration into tight spaces and dense circuit board layouts.

Output Polarity: COMPLEMENTARY

The complementary output polarity ensures accurate signal transmission and compatibility with a wide range of devices and systems.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering and connection reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product can withstand the soldering process without damage or performance degradation.

Length: 2 mm

The compact length of the product allows for efficient use of space on the circuit board while maintaining signal integrity and performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate reliably in harsh environmental conditions typical of industrial applications.

Technology: BICMOS

The Bipolar CMOS (BiCMOS) technology combines the advantages of both bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Terminal Form: NO LEAD

The no-lead terminal form complies with environmental regulations, offering a more eco-friendly and sustainable option for electronic assemblies.

Nominal Supply Voltage: 2.5 V

The specified nominal supply voltage ensures compatibility with systems and devices designed to operate within this voltage range.

Maximum Delay: 0.63 ns

The minimal maximum delay ensures fast and efficient signal translation with minimal latency, maintaining high performance in data transmission.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for precise and reliable connections, enabling high-speed signal transmission and accurate data processing.

Interface IC Type: PECL TO LVDS TRANSLATOR

The PECL to LVDS translator interface IC type offers signal translation capabilities between different logic standards, enabling seamless communication in mixed-signal systems.

Technical Specifications

Voltage Level Translators SN65LVP18DRFTG4 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

.63 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

SN65LVP18DRFTG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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