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NVT2010PW

NXP Semiconductors

NVT2010PW by NXP Semiconductors

NVT2010PW by NXP Semiconductors is a 10-bit voltage level translator with a max supply voltage of 5.5V and operates in -40 °C to 85 °C. Its open-drain output and small outline package make it ideal for industrial applications. This device ensures efficient signal conversion b/w GTL and TTL interfaces.

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Chip Stock

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Flip Electronics

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One Stop Electronics

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Overview

Unlock seamless communication between different logic levels with the NVT2010PW from NXP Semiconductors. Engineered for reliability and precision, this voltage level translator excels in versatile applications, ensuring your devices operate smoothly across diverse environments. With NXP's commitment to quality and innovation, you gain a robust solution that enhances system performance while streamlining design complexity. Elevate your projects today with unmatched value and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides reliable protection against environmental factors, ensuring durability in a wide range of applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern PCBs, making this voltage level translator ideal for space-constrained applications.

Maximum Supply Voltage: 5.4 V

A higher maximum supply voltage enhances compatibility with various devices, supporting a wider range of applications.

Package Shape: RECTANGULAR

The rectangular shape ensures ease of mounting and optimized space usage on circuit boards.

No. of Bits: 10

A 10-bit configuration allows for efficient data transfer and versatility in handling multiple signals, making it suitable for a variety of data bus widths.

Maximum Supply Voltage-1: 5.5 V

Allows for even broader device compatibility, providing flexibility for use in diverse applications.

No. of Terminals: 24

With 24 terminals, the device can accommodate complex circuit connections, enhancing the versatility in design implementation.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and thin profile makes it suitable for applications where minimizing board space is paramount.

Minimum Supply Voltage-1: 0 V

A minimum supply voltage of 0 V allows for low power consumption, making it efficient for battery-operated devices.

Minimum Supply Voltage: 0 V

Allows the device to operate from a very low voltage environment, compatible with low-power logic levels.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in industrial applications where heat can be a concern.

Output Characteristics: OPEN-DRAIN

Open-drain outputs provide flexibility in circuit design, enabling wired-AND configurations, ideal for multi-device communication.

Minimum Operating Temperature: -40 °C

A wide operating temperature range makes this product suitable for harsh environments, increasing its reliability in critical applications.

Terminal Position: DUAL

Dual terminal positioning allows for versatile positioning on printed circuit boards, optimizing design layouts.

Maximum Seated Height: 1.1 mm

A low seated height contributes to the slim profile of the design, aiding in space-saving solutions.

Width: 4.4 mm

A compact width allows for high-density placement on PCBs, suitable for modern electronic devices.

Length: 7.8 mm

Short length aids in compactness and efficiency in handling space on circuit boards, essential for finely packed designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability over a wide temperature range, making it suitable for demanding applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide robust mechanical strength in connections, ensuring durability.

Input Characteristics: STANDARD

Standard input characteristics ensure broad compatibility with various logic levels and devices.

Maximum Delay: 0.375 ns

A minimal delay ensures high-speed data transmission, making it an excellent choice for applications requiring fast switching.

Terminal Pitch: 0.65 mm

The compact terminal pitch is optimal for high-density mounting, essential for today's complex electronic designs.

Interface IC Type: GTL TO TTL TRANSCEIVER

As a GTL to TTL transceiver, this product provides seamless interfacing between different voltage standards, enhancing system compatibility.

Technical Specifications

Voltage Level Translators NVT2010PW attributes and parameters. Explore more Voltage Level Translators devices from NXP Semiconductors

Specs

Additional Features:

TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE

Maximum Delay:

.375 ns

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Latch/Register:

NONE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

5.4 V

Minimum Supply Voltage:

0 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

0 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

NVT2010PW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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