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CD4504BPWRE4

Texas Instruments

CD4504BPWRE4 by Texas Instruments

CD4504BPWRE4 by Texas Instruments is a voltage level translator with 6 functions, operating at -55 to 125 °C. It has a supply voltage range of 5-18 V and max delay of 550 ns. Ideal for TTL/CMOS to CMOS translation in military-grade applications due to its compact size and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,783 parts In-Stock

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Digiode

USA . 4,183 parts In-Stock

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Nova Conductors

Japan . 61 parts In-Stock

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AZTECH Wire

Italy . 640 parts In-Stock

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$6.481

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640

$6.481

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Ampacity Inc.

Singapore . 1,187 parts In-Stock

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$6.500

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$6.500

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Parana Technologies

USA . 2,012 parts In-Stock

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$7.328

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$7.820

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$7.328

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$7.820

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DigiPath Technology Company

USA . 2,167 parts In-Stock

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$8.069

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$8.069

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IDEA Electronic Components Group

UK . 2,211 parts In-Stock

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$8.234

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$7.411

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2,211

$8.234

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$7.411

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ChromeModa Solutions

Germany . 408 parts In-Stock

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$8.234

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$6.752

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408

$8.234

$6.752

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One Stop Electronics

USA . 1,636 parts In-Stock

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$20.500

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Argo Parts USA

USA . 5,291 parts In-Stock

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Corphita

USA . 3,108 parts In-Stock

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Bastille Electronics

Australia . 870 parts In-Stock

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Continental Prestige Electronics

USA . 136 parts In-Stock

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Overview

Unlock seamless voltage level translation with the CD4504BPWRE4 by Texas Instruments. Crafted with precision and expertise, this voltage level translator offers unmatched quality and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile component ensures smooth and efficient signal processing. Elevate your projects with the value and benefits that only Texas Instruments can provide. Trust in the CD4504BPWRE4 to deliver superior performance and innovation every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that provides protection for the internal components.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards.

Maximum Supply Voltage: 18 V

Can handle high voltage levels, making it suitable for various applications.

No. of Functions: 6

Provides multiple functions in a single component, saving space and reducing complexity.

Package Shape: RECTANGULAR

Standard shape that allows for easy integration into circuit designs.

Power Supplies (V): 5/15

Compatible with a wide range of power supply voltages.

No. of Terminals: 16

Sufficient terminals for connecting to other components in a circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact size and low profile for space-efficient circuit designs.

Minimum Supply Voltage: 5 V

Can operate at low voltage levels, suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -55 °C

Can operate at low temperatures, suitable for outdoor or harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality finish for reliable electrical connections.

Terminal Position: DUAL

Provides flexibility in circuit layout and connections.

Maximum Seated Height: 1.2 mm

Low profile for compact circuit board designs.

Width: 4.4 mm

Narrow width for space-saving integration.

Output Polarity: TRUE

Consistent output polarity for simplified interfacing.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for reliable soldering.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance for manufacturing processes.

Length: 5 mm

Compact length for space-efficient circuit board layouts.

Temperature Grade: MILITARY

Suitable for military-grade applications with extreme temperature requirements.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminals for secure and reliable solder connections.

Nominal Supply Voltage: 10 V

Optimal voltage level for efficient operation.

Maximum Delay: 550 ns

Low delay time for fast signal processing.

Terminal Pitch: 0.65 mm

Fine pitch for high-density circuit board designs.

Interface IC Type: TTL/CMOS TO CMOS TRANSLATOR

Versatile interface for translating between different logic levels.

Technical Specifications

Voltage Level Translators CD4504BPWRE4 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

550 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

10 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

CD4504BPWRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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