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MC100EPT22DR2G

Onsemi

MC100EPT22DR2G by Onsemi

MC100EPT22DR2G by Onsemi is a voltage level translator with 2 functions, operating at 3.3V. It has a max delay of 0.7ns and interfaces TTL/CMOS to PECL signals. Ideal for industrial applications requiring precise signal translation in compact designs.

Median Price

$7.291

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,066 parts In-Stock

1+ parts

$9.340

100+ parts

$6.256

1k+ parts

-

10k+ parts

$5.471

3,066

$9.340

$6.256

-

$5.471

Mouser Electronics

USA . 2,490 parts In-Stock

1+ parts

$9.340

100+ parts

$6.260

1k+ parts

$5.590

10k+ parts

$5.460

2,490

$9.340

$6.260

$5.590

$5.460

Flip Electronics (Authorized)

USA . 137,720 parts In-Stock

1+ parts

-

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137,720

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Avnet

USA . 2,500 parts In-Stock

1+ parts

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$5.242

2,500

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-

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$5.242

Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$5.120

1k+ parts

$4.580

10k+ parts

$4.310

2

-

$5.120

$4.580

$4.310

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 911 parts In-Stock

1+ parts

$5.396

100+ parts

-

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911

$5.396

-

-

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Vyrian

USA . 1,261 parts In-Stock

1+ parts

$5.680

100+ parts

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1,261

$5.680

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Flip Electronics

USA . 96,119 parts In-Stock

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96,119

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Chip Stock

USA . 8,500 parts In-Stock

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8,500

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ECAB

Sweden . 2,500 parts In-Stock

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2,500

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ACDS - Activité Composants Distribution Service

France . 1,692 parts In-Stock

1+ parts

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1,692

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Bristol Electronics

USA . 1,692 parts In-Stock

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1,692

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 395 parts In-Stock

1+ parts

$0.631

100+ parts

-

1k+ parts

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10k+ parts

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395

$0.631

-

-

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Ampacity Inc.

Singapore . 35,715 parts In-Stock

1+ parts

$4.830

100+ parts

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35,715

$4.830

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Corphita

USA . 1,185 parts In-Stock

1+ parts

$5.112

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1,185

$5.112

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Component Stockers USA

USA . 7,622 parts In-Stock

1+ parts

$5.810

100+ parts

$5.460

1k+ parts

$5.230

10k+ parts

-

7,622

$5.810

$5.460

$5.230

-

Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$10.310

100+ parts

$9.382

1k+ parts

$8.454

10k+ parts

-

70

$10.310

$9.382

$8.454

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Microchip USA

USA . 4,749 parts In-Stock

1+ parts

$15.777

100+ parts

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4,749

$15.777

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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22,000

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Infinite Electronics LLP (Excess)

. 17,510 parts In-Stock

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SupplyDigital Components

Austria . 4,488 parts In-Stock

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Problanco Electronics

Mexico . 3,134 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Kepictronics

USA . 1,096 parts In-Stock

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Perfect Parts

USA . 1,081 parts In-Stock

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Kulean Microsystems

USA . 1,055 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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TANS Electronics

Latvia . 284 parts In-Stock

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284

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UHIMA Technologies

Türkiye . 231 parts In-Stock

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231

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Overview

Discover the power of seamless voltage level translation with the MC100EPT22DR2G by Onsemi. Crafted with precision and quality, this small outline package offers a reliable solution for your industrial applications. With its dual terminal position and complementary output polarity, this TTL/CMOS to PECL translator ensures smooth communication between different systems. Trust in Onsemi's expertise and elevate your projects with the MC100EPT22DR2G's fast response time and wide operating temperature range. Embrace efficiency and precision with this innovative voltage level translator.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the internal components of the voltage level translator.

Surface Mount: YES

Facilitates easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of input voltages, making it versatile for various applications.

No. of Functions: 2

Having multiple functions in a single device enhances efficiency and saves space on the circuit board.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient and fits well within the layout of a circuit board.

Power Supplies (V): 3.3

Operates at a standard voltage level, ensuring compatibility with common power sources.

No. of Terminals: 8

Sufficient number of terminals for connecting to other components in the circuit, allowing for effective signal transmission.

Minimum Supply Voltage: 3 V

Can function reliably even at lower supply voltages, providing flexibility in power requirements.

Maximum Operating Temperature: 85 °C

Capable of withstanding high temperatures, suitable for industrial environments where heat may be a concern.

Minimum Operating Temperature: -40 °C

Designed to operate in extreme cold conditions, ensuring performance in various temperature environments.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and electrical conductivity for secure connections.

Terminal Position: DUAL

The dual terminal position allows for flexibility in installation and wiring configurations.

Maximum Seated Height: 1.75 mm

Low profile design helps in space-constrained applications and reduces the overall height of the circuit board.

Width: 3.9 mm

Compact width size that saves space on the circuit board and allows for dense integration of components.

Output Polarity: COMPLEMENTARY

Provides complementary outputs, which can be useful in certain signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 30

Capable of withstanding peak reflow temperatures for a specified duration during assembly processes.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during soldering processes, ensuring reliability and robustness.

Length: 4.9 mm

Compact length size that contributes to space efficiency on the circuit board.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature standards, suitable for harsh operating conditions.

Technology: ECL

Utilizes Emitter-Coupled Logic technology, known for high-speed operation and low power consumption.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and ease of soldering during assembly.

Nominal Supply Voltage: 3.3 V

Operates at a standard nominal voltage, ensuring compatibility with common power sources.

Maximum Delay: 0.7 ns

Low delay time ensures fast signal transmission, crucial for high-speed applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch size that allows for easy connection and compatibility with common connectors.

Interface IC Type: TTL/CMOS TO PECL TRANSLATOR

Provides a conversion interface from TTL/CMOS logic levels to PECL logic levels, enabling compatibility between different signal standards.

Technical Specifications

Voltage Level Translators MC100EPT22DR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.7 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100EPT22DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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