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SN65LVP19DRFRG4

Texas Instruments

SN65LVP19DRFRG4 by Texas Instruments

SN65LVP19DRFRG4 by Texas Instruments is a voltage level translator with a supply voltage range of 2.375V to 3.6V, suitable for industrial applications. It features PECL to LVDS translation, operates in temperatures from -40°C to 85°C, and has a max delay of 0.63ns. This small outline package with dual terminals is designed for surface mount assembly at a seated height of 0.8mm.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,007 parts In-Stock

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Digiode

USA . 2,284 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,810 parts In-Stock

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$5.446

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$6.158

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$5.446

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$6.158

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IDEA Electronic Components Group

UK . 2,305 parts In-Stock

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$6.119

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$5.507

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$6.119

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ChromeModa Solutions

Germany . 2,042 parts In-Stock

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$6.119

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$5.018

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$6.119

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AZTECH Wire

Italy . 818 parts In-Stock

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$17.253

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One Stop Electronics

USA . 1,445 parts In-Stock

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$45.500

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$45.500

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Component Stockers USA

USA . 717 parts In-Stock

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$99.990

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717

$99.990

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DigiPath Technology Company

USA . 2,286 parts In-Stock

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$5.517

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Corphita

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Microchip USA

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Overview

Unlock seamless voltage level translation with the SN65LVP19DRFRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that guarantee reliability and performance. Ideal for a wide range of applications, this voltage level translator offers customers unparalleled value and benefits. Say goodbye to compatibility issues and hello to smooth communication between different voltage domains. Trust Texas Instruments to provide you with the solution you need for your electronic designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the voltage level translator, ensuring its longevity and reliability.

Surface Mount: YES

Being surface mountable makes the installation of this voltage level translator easier and more convenient, especially in compact electronic devices.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this voltage level translator can handle a wide range of input voltages and thus offers versatility in various applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, making this voltage level translator suitable for compact designs.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages enhances compatibility with different systems, providing flexibility in implementation.

No. of Terminals: 8

Having 8 terminals allows for the connection of multiple input and output signals, enabling effective signal translation in complex circuitry.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style contribute to space-saving and efficient heat dissipation, making this voltage level translator suitable for compact and high-performance applications.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage allows for operation in systems with lower power requirements, increasing the versatility of this voltage level translator.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this voltage level translator can withstand harsh environmental conditions and maintain reliable performance in various temperature ranges.

Minimum Operating Temperature: -40 °C

The ability to operate at a low minimum temperature ensures the functionality of this voltage level translator even in cold environments, expanding its application range.

Terminal Position: DUAL

Dual terminal positions provide flexibility in connecting the voltage level translator in different orientations, simplifying the installation process.

Maximum Seated Height: 0.8 mm

The low maximum seated height enables a compact form factor for the voltage level translator, making it suitable for space-constrained designs.

Width: 2 mm

The narrow width of 2 mm contributes to the compact and space-efficient design of this voltage level translator, facilitating integration into tight spaces on a circuit board.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies signal interpretation and processing, enhancing the compatibility of this voltage level translator with various systems.

Length: 2 mm

The short length of 2 mm further enhances the compact footprint of this voltage level translator, making it suitable for applications where board space is limited.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures the reliability and stability of this voltage level translator in demanding industrial environments.

Technology: BICMOS

BICMOS technology combines the advantages of bipolar and CMOS technologies, offering high-performance signal translation with low power consumption in this voltage level translator.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the soldering process and minimizes solder joint stress, contributing to the reliability of this voltage level translator.

Nominal Supply Voltage: 2.5 V

Having a nominal supply voltage of 2.5 V ensures compatibility with standard power supply voltages, simplifying integration into existing systems.

Maximum Delay: 0.63 ns

The low maximum delay of 0.63 ns ensures fast signal translation, reducing latency and improving the overall performance of this voltage level translator.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for densely packed connections on a circuit board, optimizing space utilization and facilitating high-speed signal transmission.

Interface IC Type: PECL TO LVDS TRANSLATOR

Supporting PECL to LVDS translation, this voltage level translator enables seamless communication between devices with different signal standards, enhancing interoperability in mixed-signal systems.

Technical Specifications

Voltage Level Translators SN65LVP19DRFRG4 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

.63 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-N8

Length:

2 mm

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Trade Compliance

SN65LVP19DRFRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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