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MC10ELT24DR2G

Onsemi

MC10ELT24DR2G by Onsemi

MC10ELT24DR2G by Onsemi is a voltage level translator with 8 terminals and ECL technology. It operates b/w -40 to 85 °C, translating TTL to ECL signals with a delay of 2 ns. Ideal for industrial applications requiring precise signal translation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,618 parts In-Stock

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6,618

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Digiode

USA . 1,904 parts In-Stock

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AZTECH Wire

Italy . 1,112 parts In-Stock

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$14.610

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$14.610

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Ampacity Inc.

Singapore . 1,411 parts In-Stock

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$35.500

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$35.500

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QUARKTWIN TECHNOLOGY LTD

USA . 12,643 parts In-Stock

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TANS Electronics

Latvia . 7,204 parts In-Stock

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Kulean Microsystems

USA . 7,041 parts In-Stock

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Problanco Electronics

Mexico . 6,714 parts In-Stock

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Microchip USA

USA . 6,138 parts In-Stock

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Perfect Parts

USA . 5,544 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 3,331 parts In-Stock

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Corphita

USA . 1,465 parts In-Stock

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UHIMA Technologies

Türkiye . 443 parts In-Stock

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Corohmni

South Africa . 241 parts In-Stock

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Overview

Enhance your voltage level translation needs with the MC10ELT24DR2G by Onsemi. This top-quality product boasts a durable plastic/epoxy package and superior surface mount capabilities. Perfect for industrial applications, this TTL to ECL translator offers fast 2ns maximum delay and reliable performance in extreme temperatures. Trust Onsemi's expertise in voltage level translators and experience seamless signal conversion with the MC10ELT24DR2G. Elevate your projects with precision and efficiency today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the internal components of the voltage level translator, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V provides flexibility in operating requirements and compatibility with various systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement and organization on a circuit board, optimizing space utilization.

Power Supplies (V): 5,-4.5/-5.2

The dual power supply options make it versatile for different system configurations and power requirements.

No. of Terminals: 8

Having 8 terminals enables connectivity to multiple input and output signals, enhancing functionality and compatibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact designs and applications.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement of 4.5V ensures efficient power usage and compatibility with a range of systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the voltage level translator can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable performance in cold environments.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and reliable electrical connections for long-term performance.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in connectivity and installation, accommodating different circuit layouts.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75mm enables a compact and slim profile for the voltage level translator.

Width: 3.9 mm

The narrow width of 3.9mm allows for efficient space utilization on the circuit board.

Output Polarity: COMPLEMENTARY

The complementary output polarity simplifies signal processing and ensures accurate voltage level translation.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C enables reliable solder joints and durability during the manufacturing process.

Length: 4.9 mm

The compact length of 4.9mm contributes to the overall small footprint of the voltage level translator.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in a wide range of operating conditions and environments.

Technology: ECL

The ECL technology offers high-speed operation and precise voltage translation, making it suitable for demanding applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and connection to the circuit board, ensuring a secure and reliable electrical interface.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources and systems.

Nominal Negative Supply Voltage: -5 V

The nominal negative supply voltage of -5V allows for seamless integration with systems requiring both positive and negative voltage levels.

Maximum Delay: 2 ns

The low maximum delay of 2ns ensures fast and efficient voltage level translation, minimizing signal distortion and delays.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27mm allows for easy integration and compatibility with common PCB layouts and designs.

Interface IC Type: TTL TO ECL TRANSLATOR

The TTL to ECL translator interface IC type enables seamless communication and signal conversion between different logic levels, enhancing system compatibility and functionality.

Technical Specifications

Voltage Level Translators MC10ELT24DR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-4.5/-5.2

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10ELT24DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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