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MC100H600FNR2G

Onsemi

MC100H600FNR2G by Onsemi

MC100H600FNR2G by Onsemi is a voltage level translator with 9 functions, operating at 0-75 °C. It features TTL to ECL translation, with a delay of 3.2ns and power supplies of 5V and -4.5V. Ideal for applications requiring precise signal conversion in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,927 parts In-Stock

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Digiode

USA . 940 parts In-Stock

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QIE Inc.

USA . 125 parts In-Stock

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125

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Problanco Electronics

Mexico . 5,416 parts In-Stock

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TANS Electronics

Latvia . 5,285 parts In-Stock

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SupplyDigital Components

Austria . 2,179 parts In-Stock

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Kulean Microsystems

USA . 2,059 parts In-Stock

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Corphita

USA . 1,992 parts In-Stock

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UHIMA Technologies

Türkiye . 443 parts In-Stock

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Microchip USA

USA . 313 parts In-Stock

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Corohmni

South Africa . 175 parts In-Stock

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Overview

Experience seamless voltage level translation with the MC100H600FNR2G by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. Ideal for a wide range of applications, this voltage level translator offers unparalleled performance and efficiency. Unlock new possibilities and enhance your projects with the MC100H600FNR2G - the ultimate solution for all your voltage translation needs. Trust Onsemi to deliver cutting-edge technology that exceeds expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, ensuring the reliability and durability of the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

Can support higher voltage levels, making it suitable for a wide range of applications.

No. of Functions: 9

Offers multiple functions in a single device, providing versatility and efficiency in circuit design.

Package Shape: SQUARE

Helps in efficient use of space on the circuit board, enabling compact and organized layouts.

Power Supplies (V): 5,-4.5

Supports dual power supply inputs, offering flexibility in powering the device.

No. of Terminals: 28

Provides ample connection points for interfacing with other components in the circuit.

Package Style (Meter): CHIP CARRIER

Chip carrier package style enhances thermal performance and allows for high-density mounting.

Minimum Supply Voltage: 4.5 V

Works efficiently with lower supply voltages, ensuring compatibility with various systems.

Maximum Operating Temperature: 75 °C

Can operate effectively in high-temperature environments, increasing the product's reliability.

Output Characteristics: OPEN-EMITTER

Offers versatility in output configurations for different circuit requirements.

Minimum Operating Temperature: 0 °C

Capable of functioning in a wide temperature range, suitable for diverse operational settings.

Terminal Finish: TIN

Tin finish provides good conductivity and corrosion resistance, ensuring long-term performance.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and connectivity in the circuit.

Maximum Seated Height: 4.57 mm

Low profile design helps in saving space and enables compact circuit board layouts.

Width: 11.505 mm

Compact width dimensions facilitate efficient placement on the circuit board.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and processing.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly processes without damage.

Length: 11.505 mm

Optimal length dimensions for easy integration into circuit board designs.

Temperature Grade: COMMERCIAL EXTENDED

Designed for reliable operation under extended temperature ranges in commercial applications.

Technology: ECL100K

Utilizes advanced ECL technology for high-speed and low-power performance.

Terminal Form: J BEND

J bend terminal form enhances mechanical stability and solder joint strength.

Nominal Supply Voltage: 5 V

Stable 5V nominal supply voltage for consistent and reliable operation.

Maximum Delay: 3.2 ns

Low delay time ensures fast signal transmission and minimal latency in the system.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy soldering and connection with other components.

Interface IC Type: TTL TO ECL TRANSLATOR

Specialized interface IC type for precise translation between TTL and ECL logic levels.

Technical Specifications

Voltage Level Translators MC100H600FNR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.2 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

No. of Bits:

1

No. of Functions:

9

No. of Terminals:

28

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-4.5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL100K

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100H600FNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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