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MC10H350MELG

Onsemi

MC10H350MELG by Onsemi

MC10H350MELG by Onsemi is a voltage level translator with 4 functions, operating at 5V. It features PECL to TTL translation, 5ns max delay, and 3-STATE output characteristics. Ideal for commercial applications requiring ECL technology in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,301 parts In-Stock

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Digiode

USA . 706 parts In-Stock

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Problanco Electronics

Mexico . 5,736 parts In-Stock

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Microchip USA

USA . 3,858 parts In-Stock

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TANS Electronics

Latvia . 3,211 parts In-Stock

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Corphita

USA . 1,207 parts In-Stock

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SupplyDigital Components

Austria . 1,014 parts In-Stock

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UHIMA Technologies

Türkiye . 309 parts In-Stock

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Kulean Microsystems

USA . 163 parts In-Stock

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Corohmni

South Africa . 104 parts In-Stock

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Overview

Unlock seamless voltage level translation with the MC10H350MELG by Onsemi. Crafted with precision and expertise, this voltage level translator is designed to elevate your electronics to new heights. Perfect for a wide range of applications, this versatile component boasts unmatched quality and reliability. Experience smooth signal conversion and enhanced performance with Onsemi's cutting-edge technology. Upgrade your projects today with the MC10H350MELG and discover the difference in efficiency and precision it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring reliability during use.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this voltage level translator can support a wide range of input voltages, enhancing its versatility.

No. of Functions: 4

Having multiple functions in one device saves board space and simplifies circuit design, making it a cost-effective solution.

Power Supplies (V): 5

Operating at a standard power supply voltage of 5V makes this device compatible with common electronic systems, ensuring ease of integration.

No. of Terminals: 16

Having a high number of terminals provides flexibility in connectivity options, enabling the device to interface with various components and systems.

Minimum Operating Temperature: 0 °C

The wide operating temperature range from 0 °C ensures reliable performance in various environmental conditions, making it suitable for different applications.

Maximum Delay: 5 ns

With a low maximum delay of 5ns, this voltage level translator ensures high-speed signal conversion, essential for time-sensitive applications.

Technical Specifications

Voltage Level Translators MC10H350MELG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

5 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H350MELG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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