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MC10H351FNG

Onsemi

MC10H351FNG by Onsemi

TTL/NMOS TO ECL TRANSLATOR; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;

Median Price

$10.530

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,009 parts In-Stock

1+ parts

-

100+ parts

$9.360

1k+ parts

$8.370

10k+ parts

$7.880

5,009

-

$9.360

$8.370

$7.880

Verical

USA . 4,024 parts In-Stock

1+ parts

-

100+ parts

$11.700

1k+ parts

$10.463

10k+ parts

-

4,024

-

$11.700

$10.463

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,606 parts In-Stock

1+ parts

$9.899

100+ parts

-

1k+ parts

-

10k+ parts

-

1,606

$9.899

-

-

-

Vyrian

USA . 8,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,406

-

-

-

-

R&J Components

USA . 136 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

136

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,330 parts In-Stock

1+ parts

$8.860

100+ parts

-

1k+ parts

-

10k+ parts

-

4,330

$8.860

-

-

-

Corphita

USA . 382 parts In-Stock

1+ parts

$9.378

100+ parts

-

1k+ parts

-

10k+ parts

-

382

$9.378

-

-

-

Corohmni

South Africa . 130 parts In-Stock

1+ parts

$10.420

100+ parts

-

1k+ parts

-

10k+ parts

-

130

$10.420

-

-

-

Component Stockers USA

USA . 7,060 parts In-Stock

1+ parts

$10.630

100+ parts

$10.000

1k+ parts

$9.040

10k+ parts

-

7,060

$10.630

$10.000

$9.040

-

AZTECH Wire

Italy . 816 parts In-Stock

1+ parts

$13.460

100+ parts

-

1k+ parts

-

10k+ parts

-

816

$13.460

-

-

-

Kepictronics

USA . 11,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,800

-

-

-

-

Problanco Electronics

Mexico . 6,741 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,741

-

-

-

-

TANS Electronics

Latvia . 4,756 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,756

-

-

-

-

SupplyDigital Components

Austria . 2,634 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,634

-

-

-

-

Kulean Microsystems

USA . 2,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,536

-

-

-

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UHIMA Technologies

Türkiye . 538 parts In-Stock

1+ parts

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100+ parts

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538

-

-

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Microchip USA

USA . 213 parts In-Stock

1+ parts

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213

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Perfect Parts

USA . 119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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119

-

-

-

-

Technical Specifications

Voltage Level Translators MC10H351FNG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.2 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC(UNSPEC)

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10H351FNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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