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MC10H600FN

Onsemi

MC10H600FN by Onsemi

MC10H600FN by Onsemi is a voltage level translator with 9 functions, operating at 4.5-5.5V supply range. It has a max delay of 3.2ns and interfaces TTL to ECL signals, suitable for commercial extended temperature applications.

Median Price

$4.050

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 1,097 parts In-Stock

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-

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$3.500

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$3.130

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$2.940

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$2.940

DigiKey

USA . 1,097 parts In-Stock

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$4.050

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Verical

USA . 708 parts In-Stock

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$4.375

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$3.913

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$3.675

708

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$3.913

$3.675

Distributors (In-Stock)

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Vyrian

USA . 1,098 parts In-Stock

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$3.420

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Digiode

USA . 266 parts In-Stock

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$3.696

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Electronics Depot

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Prism Electronics

USA . 769 parts In-Stock

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Semi Source

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J & M Industries LLC

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Speed Components Ltd

Israel . 102 parts In-Stock

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Connector Distribution Corp

USA . 96 parts In-Stock

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Right Parts Inc.

USA . 96 parts In-Stock

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A2Z Electronics, Inc.

USA . 53 parts In-Stock

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Sogenti Electronics

Canada . 34 parts In-Stock

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Elcom Components

USA . 27 parts In-Stock

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PC Components Company LLC

USA . 10 parts In-Stock

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

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Resion

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First Choice Components Inc.

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Distributors (Availability)

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Corohmni

South Africa . 356 parts In-Stock

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$3.420

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356

$3.420

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Corphita

USA . 780 parts In-Stock

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$3.501

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Perfect Parts

USA . 23,284 parts In-Stock

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Problanco Electronics

Mexico . 4,031 parts In-Stock

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SupplyDigital Components

Austria . 2,700 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

USA . 1,097 parts In-Stock

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TANS Electronics

Latvia . 1,090 parts In-Stock

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Kepictronics

USA . 779 parts In-Stock

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UHIMA Technologies

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Kulean Microsystems

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Microchip USA

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Assy Fe

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Overview

Unlock a world of seamless voltage translation with the MC10H600FN by Onsemi. Crafted with precision and reliability, this voltage level translator offers unparalleled performance in a compact chip carrier package. From TTL to ECL translation, this versatile device boasts 9 functions and a wide operating temperature range, making it ideal for a variety of applications. Experience next-level efficiency and accuracy with Onsemi's cutting-edge technology, bringing value and innovation to every project. Elevate your designs with the MC10H600FN today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Can handle high supply voltages, providing flexibility in different circuit setups.

No. of Functions: 9

Offers multiple functions in a single component, reducing the need for additional components.

Package Shape: SQUARE

A compact shape that helps save space on the circuit board.

Power Supplies (V): 5,-5.2

Supports dual power supplies, allowing for versatile power configurations.

No. of Terminals: 28

Provides ample contact points for connecting to other components.

Maximum Operating Temperature: 75 °C

Can operate in high temperature environments without issues.

Output Characteristics: OPEN-EMITTER

Provides an open collector output for easy interfacing with other components.

Minimum Operating Temperature: 0 °C

Can function in low temperature environments as well.

Terminal Finish: TIN LEAD

Ensures good conductivity and reliability of the terminal connections.

Terminal Position: QUAD

Arrangement of terminals allows for efficient routing of connections.

Width: 11.505 mm

Compact width for space-saving on the circuit board.

Output Polarity: TRUE

Correct output polarity for seamless integration with other components.

Maximum Delay: 3.2 ns

Low delay ensures fast and responsive signal translation.

Interface IC Type: TTL TO ECL TRANSLATOR

Specifically designed for translating signals between TTL and ECL logic levels.

Technical Specifications

Voltage Level Translators MC10H600FN attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.2 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

9

No. of Terminals:

28

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL10K

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10H600FN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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