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MC10H352L

Onsemi

MC10H352L by Onsemi

MC10H352L by Onsemi is a voltage level translator with 4 functions, operating at 5V. It has a max supply voltage of 5.25V and min of 4.75V, suitable for TTL/CMOS to PECL translation applications. With a package style of IN-LINE and ECL technology, it offers fast performance with a max delay of 2ns at an extended commercial temperature range up to 75 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,259 parts In-Stock

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Digiode

USA . 1,835 parts In-Stock

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1,835

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Problanco Electronics

Mexico . 7,805 parts In-Stock

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TANS Electronics

Latvia . 4,792 parts In-Stock

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SupplyDigital Components

Austria . 4,621 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kulean Microsystems

USA . 668 parts In-Stock

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UHIMA Technologies

Türkiye . 420 parts In-Stock

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Corphita

USA . 273 parts In-Stock

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Corohmni

South Africa . 207 parts In-Stock

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Kepictronics

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Overview

Elevate your voltage level translation needs with the MC10H352L by Onsemi. This top-quality product boasts unparalleled performance and reliability, thanks to its innovative design and superior manufacturing standards. Ideal for a wide range of applications, this voltage translator offers seamless integration and precision output characteristics. Say goodbye to compatibility issues and hello to efficient signal conversion with the MC10H352L. Unlock new possibilities and elevate your projects with this game-changing solution from Onsemi.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides excellent durability and protection for the internal components, ensuring long-term reliability.

Maximum Supply Voltage: 5.25 V

Can handle high voltage inputs, making it suitable for a wide range of applications.

No. of Functions: 4

Offers versatility with multiple functions in a single package, reducing the need for additional components.

Package Shape: RECTANGULAR

Facilitates easy integration into circuit layouts and designs.

Power Supplies (V): 5

Operates efficiently at the standard voltage level, ensuring compatibility with common power sources.

No. of Terminals: 20

Provides ample connection points for various input and output signals.

Package Style (Meter): IN-LINE

Saves space and simplifies PCB layout with a streamlined inline design.

Minimum Supply Voltage: 4.75 V

Allows for operation at lower input voltages without sacrificing performance.

Maximum Operating Temperature: 75 °C

Ensures reliable operation in high-temperature environments.

Output Characteristics: OPEN-EMITTER

Enables flexibility in signal routing and compatibility with various output configurations.

Minimum Operating Temperature: 0 °C

Can function reliably in a wide range of temperature conditions.

Terminal Finish: TIN LEAD

Provides excellent conductivity and solderability for secure terminal connections.

Terminal Position: DUAL

Offers flexibility in mounting options and ease of integration into different circuit layouts.

Maximum Seated Height: 5.08 mm

Compact size for space-constrained applications.

Width: 7.62 mm

Compact form factor for easy integration into circuit designs.

Output Polarity: COMPLEMENTARY

Provides complementary output signals for enhanced signal integrity.

Length: 24.515 mm

Optimal length for fitting into standard PCB layouts.

Temperature Grade: COMMERCIAL EXTENDED

Suitable for use in a wide range of commercial and extended temperature environments.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed signal processing and low power consumption.

Terminal Form: THROUGH-HOLE

Enables easy and secure mounting on PCBs through traditional soldering methods.

Nominal Supply Voltage: 5 V

Operates efficiently at the standard voltage level, ensuring compatibility with common power sources.

Maximum Delay: 2 ns

Provides fast signal processing with minimal delay, ideal for high-speed applications.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy connection to external components and devices.

Interface IC Type: TTL/CMOS TO PECL TRANSLATOR

Facilitates seamless translation of signals between different logic levels, enhancing overall system compatibility.

Technical Specifications

Voltage Level Translators MC10H352L attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2 ns

Interface IC Type:

JESD-30 Code:

R-CDIP-T20

JESD-609 Code:

e0

Length:

24.515 mm

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC10H352L Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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