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MC100EPT22DTR2

Onsemi

MC100EPT22DTR2 by Onsemi

MC100EPT22DTR2 by Onsemi is a voltage level translator with 2 functions, operating at 3.3V. It has a max delay of 0.7ns and interfaces TTL/CMOS to PECL signals. Ideal for industrial applications requiring precise signal translation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 1,123 parts In-Stock

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PC Components Company LLC

USA . 618 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 550 parts In-Stock

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550

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Dan-Mar Components

USA . 550 parts In-Stock

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550

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Semi Source

USA . 290 parts In-Stock

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290

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Digiode

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Vyrian

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Problanco Electronics

Mexico . 7,567 parts In-Stock

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SupplyDigital Components

Austria . 4,551 parts In-Stock

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Kulean Microsystems

USA . 4,245 parts In-Stock

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TANS Electronics

Latvia . 3,094 parts In-Stock

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Corphita

USA . 2,031 parts In-Stock

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UHIMA Technologies

Türkiye . 754 parts In-Stock

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Corohmni

South Africa . 85 parts In-Stock

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Overview

Experience seamless voltage level translation with the MC100EPT22DTR2 by Onsemi. Crafted with precision and quality, this voltage level translator offers reliable performance and versatility in a variety of applications. From industrial automation to telecommunications, this compact device ensures smooth signal transmission with a wide supply voltage range and minimal delay. Trust Onsemi's expertise in semiconductor manufacturing to deliver innovative solutions for your electronic design needs. Elevate your projects with the MC100EPT22DTR2 and unlock new possibilities in voltage level translation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protects the internal components of the voltage level translator.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 2

Having multiple functions in a single device can help simplify the circuit design and save space on the PCB.

Package Shape: SQUARE

The square shape allows for efficient use of space on the circuit board and makes it suitable for compact designs.

Power Supplies (V): 3.3

Operates on a commonly used supply voltage, ensuring compatibility with many systems.

No. of Terminals: 8

Sufficient terminals for connecting to various components and circuits, offering flexibility in the design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact size and thin profile make it suitable for space-constrained applications, and shrink pitch layout enhances PCB routing efficiency.

Minimum Supply Voltage: 3 V

Operates reliably even at low supply voltages, ensuring stable performance in different operating conditions.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operates reliably even in extremely low-temperature conditions, providing versatility for a wide range of environments.

Terminal Finish: TIN LEAD

Provides good conductivity and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB layout and can accommodate different connection configurations.

Maximum Seated Height: 1.1 mm

Low profile design fits in compact spaces and minimizes interference with neighboring components.

Width: 3 mm

Compact width allows for efficient use of space on the PCB without sacrificing performance.

Output Polarity: COMPLEMENTARY

Complementary output polarity can help improve signal integrity and reduce noise in the system.

Peak Reflow Temperature °C: 235

Can withstand high reflow temperatures during manufacturing processes, ensuring reliability during assembly.

Length: 3 mm

Compact length allows for efficient use of space on the PCB without compromising functionality.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial applications where temperature fluctuations are common, ensuring reliable operation.

Technology: ECL

Uses ECL technology for high-speed and low-power operation, making it ideal for applications requiring fast signal translation.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and efficient soldering during assembly.

Nominal Supply Voltage: 3.3 V

Operates at a standard supply voltage, ensuring compatibility with many systems and components.

Maximum Delay: 0.7 ns

Low delay time ensures fast signal translation, making it suitable for high-speed applications.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for compact layout on the PCB and efficient routing of signals.

Interface IC Type: TTL/CMOS TO PECL TRANSLATOR

Supports multiple interface types for compatibility with various systems, making it a versatile solution for signal translation.

Technical Specifications

Voltage Level Translators MC100EPT22DTR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.7 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

MC100EPT22DTR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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