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MC100EPT23DR2G

Onsemi

MC100EPT23DR2G by Onsemi

MC100EPT23DR2G by Onsemi is a voltage level translator with 2 functions, operating at 3.3V. It has a max delay of 1.8ns and interfaces PECL to TTL signals. Ideal for industrial applications requiring precise signal translation in compact designs.

Median Price

$9.299

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,263 parts In-Stock

1+ parts

$10.960

100+ parts

$7.468

1k+ parts

-

10k+ parts

$6.510

2,263

$10.960

$7.468

-

$6.510

Mouser Electronics

USA . 1,305 parts In-Stock

1+ parts

$10.960

100+ parts

$7.470

1k+ parts

$6.660

10k+ parts

$6.330

1,305

$10.960

$7.470

$6.660

$6.330

Flip Electronics (Authorized)

USA . 86,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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86,000

-

-

-

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Rochester

USA . 15,266 parts In-Stock

1+ parts

-

100+ parts

$6.110

1k+ parts

$5.470

10k+ parts

$5.140

15,266

-

$6.110

$5.470

$5.140

Verical

USA . 11,680 parts In-Stock

1+ parts

-

100+ parts

$7.638

1k+ parts

$6.838

10k+ parts

$6.425

11,680

-

$7.638

$6.838

$6.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,886 parts In-Stock

1+ parts

$6.441

100+ parts

-

1k+ parts

-

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1,886

$6.441

-

-

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Vyrian

USA . 322 parts In-Stock

1+ parts

$6.780

100+ parts

-

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-

322

$6.780

-

-

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Bristol Electronics

USA . 4,208 parts In-Stock

1+ parts

$10.412

100+ parts

$4.511

1k+ parts

$4.269

10k+ parts

-

4,208

$10.412

$4.511

$4.269

-

Flip Electronics

USA . 86,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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86,000

-

-

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Chip Stock

USA . 15,395 parts In-Stock

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15,395

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Dan-Mar Components

USA . 4,208 parts In-Stock

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4,208

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Semi Source

USA . 2,500 parts In-Stock

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2,500

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Velocity Electronics

USA . 228 parts In-Stock

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228

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Benley Electronics

USA . 40 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

10k+ parts

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40

$0.500

-

-

-

Corphita

USA . 1,870 parts In-Stock

1+ parts

$6.102

100+ parts

-

1k+ parts

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1,870

$6.102

-

-

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Corohmni

South Africa . 131 parts In-Stock

1+ parts

$6.780

100+ parts

-

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10k+ parts

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131

$6.780

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$6.870

100+ parts

$6.252

1k+ parts

$5.633

10k+ parts

-

5,000

$6.870

$6.252

$5.633

-

Microchip USA

USA . 4,181 parts In-Stock

1+ parts

$18.832

100+ parts

-

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4,181

$18.832

-

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Kulean Microsystems

USA . 7,929 parts In-Stock

1+ parts

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7,929

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Problanco Electronics

Mexico . 7,313 parts In-Stock

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7,313

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TANS Electronics

Latvia . 2,924 parts In-Stock

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2,924

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SupplyDigital Components

Austria . 2,875 parts In-Stock

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2,875

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Speed Components Ltd (Excess)

Israel . 2,613 parts In-Stock

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2,613

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Infinite Electronics LLP (Excess)

. 2,502 parts In-Stock

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Kepictronics

USA . 2,212 parts In-Stock

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Assy Fe

Spain . 1,146 parts In-Stock

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Alle Elektronik GmbH

Germany . 928 parts In-Stock

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928

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UHIMA Technologies

Türkiye . 122 parts In-Stock

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122

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GreenTree Electronics

Israel . 50 parts In-Stock

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Authorized Procurement Solutions

USA . 48 parts In-Stock

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48

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Legend Electronics Inc. (Excess)

USA . 48 parts In-Stock

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48

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Resion (Excess)

USA . 4 parts In-Stock

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4

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Overview

Upgrade your voltage level translation needs with the MC100EPT23DR2G by Onsemi. This versatile small outline package offers high-quality performance and reliability for various industrial applications. With a maximum supply voltage of 3.6V and a minimum operating temperature of -40°C, this device ensures seamless operation in challenging environments. Experience the value and benefits of this PECL to TTL translator, enhancing your system's efficiency and functionality. Trust Onsemi's expertise and innovation to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the voltage level translator.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Can handle high supply voltages, making it versatile for different applications.

No. of Functions: 2

Provides multiple functions in a single device, saving cost and board space.

Package Shape: RECTANGULAR

Standard shape for easier integration into circuit designs.

Power Supplies (V): 3.3

Works well with typical power supply voltages, ensuring compatibility with existing systems.

No. of Terminals: 8

Provides multiple connection points for versatile interfacing with other components.

Minimum Supply Voltage: 3 V

Can operate at low supply voltages, suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments, increasing product longevity.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold temperatures, making it suitable for various operating conditions.

Terminal Finish: MATTE TIN

Provides a durable and corrosion-resistant finish for the terminals.

Terminal Position: DUAL

Allows for flexibility in the orientation of the device during installation.

Width: 3.9 mm

Compact size for space-constrained applications.

Output Polarity: TRUE

Ensures correct polarity output for compatibility with other devices.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a set duration, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during the assembly process.

Length: 4.9 mm

Compact length for space-saving on PCBs.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with varying temperature ranges.

Technology: ECL

Uses Emitter-Coupled Logic technology for fast and efficient signal translation.

Terminal Form: GULL WING

Gull wing terminals for easy surface mounting on PCBs.

Nominal Supply Voltage: 3.3 V

Works well with standard supply voltages, ensuring compatibility with most systems.

Maximum Delay: 1.8 ns

Minimal delay in signal translation, ensuring fast and efficient operation.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB designs.

Interface IC Type: PECL TO TTL TRANSLATOR

Specific interface type for translating PECL to TTL signals, making it suitable for communication between different systems.

Technical Specifications

Voltage Level Translators MC100EPT23DR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

1.8 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100EPT23DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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