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MC10H600FNG

Onsemi

MC10H600FNG by Onsemi

MC10H600FNG by Onsemi is a voltage level translator with 9 functions, operating at 4.5-5.5 V supply voltage range. It features TTL to ECL translation, open-emitter output polarity, and 3.2 ns max delay. Ideal for commercial extended temperature grade applications requiring reliable signal conversion in compact chip carrier package style.

Median Price

$7.130

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 19 parts In-Stock

1+ parts

$1.633

100+ parts

-

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19

$1.633

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Chip1Stop

Japan . 19 parts In-Stock

1+ parts

$7.130

100+ parts

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19

$7.130

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Rochester

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

$6.990

1k+ parts

$6.260

10k+ parts

$5.890

1,500

-

$6.990

$6.260

$5.890

DigiKey

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

$9.200

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1,500

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$9.200

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Verical

USA . 600 parts In-Stock

1+ parts

-

100+ parts

$8.738

1k+ parts

$7.825

10k+ parts

$7.362

600

-

$8.738

$7.825

$7.362

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,143 parts In-Stock

1+ parts

$1.551

100+ parts

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1,143

$1.551

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Vyrian

USA . 3,892 parts In-Stock

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3,892

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 468 parts In-Stock

1+ parts

$1.470

100+ parts

-

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468

$1.470

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Corohmni

South Africa . 435 parts In-Stock

1+ parts

$1.633

100+ parts

-

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435

$1.633

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Component Stockers USA

USA . 86 parts In-Stock

1+ parts

$1.830

100+ parts

$7.490

1k+ parts

$6.770

10k+ parts

-

86

$1.830

$7.490

$6.770

-

AZTECH Wire

Italy . 258 parts In-Stock

1+ parts

$19.060

100+ parts

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258

$19.060

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TANS Electronics

Latvia . 8,359 parts In-Stock

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8,359

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SupplyDigital Components

Austria . 6,870 parts In-Stock

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6,870

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Problanco Electronics

Mexico . 2,032 parts In-Stock

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2,032

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Kulean Microsystems

USA . 1,691 parts In-Stock

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1,691

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Continental Prestige Electronics

USA . 1,574 parts In-Stock

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1,574

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Kepictronics

USA . 1,080 parts In-Stock

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1,080

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UHIMA Technologies

Türkiye . 458 parts In-Stock

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458

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Microchip USA

USA . 345 parts In-Stock

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345

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Perfect Parts

USA . 90 parts In-Stock

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90

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Overview

Upgrade your voltage level translation with the MC10H600FNG by Onsemi. Made with high-quality materials and cutting-edge technology, this chip carrier package boasts 9 functions and a wide operating temperature range, perfect for various commercial applications. With fast response times and reliable performance, customers can trust in the value and benefits this translator offers. Say goodbye to compatibility issues and hello to seamless communication with the MC10H600FNG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material provides protection and longevity for the voltage level translator.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Capable of handling high voltage inputs to ensure compatibility with a wide range of devices.

No. of Functions: 9

Multiple functions in a single chip provide versatility and efficiency in voltage translation tasks.

Package Shape: SQUARE

Compact square shape facilitates easy placement and integration into circuit designs.

Power Supplies (V): 5,-5.2

Supports both positive and negative supply voltages, enabling bidirectional voltage conversion.

No. of Terminals: 28

Sufficient terminals for comprehensive connectivity options and signal routing in complex circuits.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides secure mounting and protection for the integrated circuit.

Minimum Supply Voltage: 4.5 V

Operates reliably with low supply voltages, enabling efficient power consumption in various applications.

Maximum Operating Temperature: 75 °C

Wide temperature range tolerance ensures stable performance in varying environmental conditions.

Output Characteristics: OPEN-EMITTER

Open-emitter output allows flexible connection options for different circuit configurations.

Minimum Operating Temperature: 0 °C

Can function effectively in cold temperatures, enhancing reliability in diverse operating environments.

Terminal Finish: TIN

Tin finish provides good solderability and corrosion resistance for long-term performance.

Terminal Position: QUAD

Quad terminal layout allows for easier PCB routing and soldering during assembly.

Maximum Seated Height: 4.57 mm

Low-profile design minimizes the overall board height and facilitates compact system designs.

Width: 11.505 mm

Optimal width dimension for fitting into standard circuit layouts and ensuring compatibility.

Output Polarity: TRUE

True output polarity simplifies signal interpretation and processing in the connected circuits.

Peak Reflow Temperature °C: 260

High reflow temperature capability allows for reliable soldering during manufacturing processes.

Length: 11.505 mm

Balanced length dimension for efficient placement and connection in various circuit configurations.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures reliable operation across a broad temperature range.

Technology: ECL10K

Utilizes advanced ECL10K technology for fast and efficient voltage level translation performance.

Terminal Form: J BEND

J bend terminal form simplifies installation and enhances solder joint strength on the PCB.

Nominal Supply Voltage: 5 V

Stable 5V nominal supply voltage for consistent and reliable performance in various applications.

Nominal Negative Supply Voltage: -5.2 V

Negative supply voltage support enables bidirectional signal conversion and voltage level shifting.

Maximum Delay: 3.2 ns

Low maximum delay ensures fast signal translation response times for improved system speed.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for efficient soldering and signal routing in compact circuit designs.

Moisture Sensitivity Level (MSL): 3

MSL3 rating indicates moderate sensitivity to moisture, suitable for standard manufacturing and operation.

Interface IC Type: TTL TO ECL TRANSLATOR

Specialized interface IC type for seamless translation between TTL and ECL signal levels in electronic devices.

Technical Specifications

Voltage Level Translators MC10H600FNG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.2 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

9

No. of Terminals:

28

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL10K

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10H600FNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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