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MC100EPT21DTR2G

Onsemi

MC100EPT21DTR2G by Onsemi

MC100EPT21DTR2G by Onsemi is a PECL to TTL translator with 3.3V supply, 2.25ns delay, and operates in industrial temperatures (-40 to 85 °C). It features a small outline package with dual terminals for surface mount applications. Ideal for voltage level translation in high-speed communication systems.

Median Price

$10.210

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14,201 parts In-Stock

1+ parts

$5.660

100+ parts

$5.550

1k+ parts

$5.430

10k+ parts

-

14,201

$5.660

$5.550

$5.430

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DigiKey

USA . 4,949 parts In-Stock

1+ parts

$10.210

100+ parts

$6.903

1k+ parts

-

10k+ parts

$6.027

4,949

$10.210

$6.903

-

$6.027

Mouser Electronics

USA . 3,147 parts In-Stock

1+ parts

$10.210

100+ parts

$6.910

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-

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3,147

$10.210

$6.910

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Newark

USA . 2,817 parts In-Stock

1+ parts

$10.520

100+ parts

$7.110

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-

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2,817

$10.520

$7.110

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Element14

Singapore . 3,022 parts In-Stock

1+ parts

$14.770

100+ parts

$10.000

1k+ parts

$9.600

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3,022

$14.770

$10.000

$9.600

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Chip1Stop

Japan . 609 parts In-Stock

1+ parts

$35.300

100+ parts

$14.700

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$11.000

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609

$35.300

$14.700

$11.000

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Farnell

UK . 3,022 parts In-Stock

1+ parts

-

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$5.860

1k+ parts

$5.740

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3,022

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$5.860

$5.740

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Avnet

USA . 2,500 parts In-Stock

1+ parts

-

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$5.784

2,500

-

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$5.784

Distributors (In-Stock)

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Digiode

USA . 677 parts In-Stock

1+ parts

$5.377

100+ parts

-

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677

$5.377

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Vyrian

USA . 1,415 parts In-Stock

1+ parts

$5.650

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1,415

$5.650

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Flip Electronics

USA . 9,958 parts In-Stock

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9,958

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Chip Stock

USA . 4,000 parts In-Stock

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4,000

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ComSIT Distribution GmbH

Germany . 979 parts In-Stock

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979

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Component Sense

UK . 811 parts In-Stock

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811

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EPE Components Inc.

USA . 332 parts In-Stock

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332

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Bristol Electronics

USA . 332 parts In-Stock

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332

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Netsource Technology, Inc.

USA . 309 parts In-Stock

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309

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PC Components Company LLC

USA . 228 parts In-Stock

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228

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Semtec, LLC

USA . 148 parts In-Stock

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148

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J2 Sourcing AB

Sweden . 54 parts In-Stock

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54

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SPM Sales

USA . 35 parts In-Stock

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35

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LIBRA Elektronik GmbH

Germany . 14 parts In-Stock

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Elcom Components

USA . 4 parts In-Stock

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Distributors (Availability)

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Benley Electronics

USA . 25 parts In-Stock

1+ parts

$0.450

100+ parts

-

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25

$0.450

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Ampacity Inc.

Singapore . 7,040 parts In-Stock

1+ parts

$4.800

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-

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7,040

$4.800

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Corphita

USA . 552 parts In-Stock

1+ parts

$5.094

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552

$5.094

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Corohmni

South Africa . 359 parts In-Stock

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$5.650

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359

$5.650

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Component Stockers USA

USA . 17,648 parts In-Stock

1+ parts

$9.130

100+ parts

$7.000

1k+ parts

$5.560

10k+ parts

$5.230

17,648

$9.130

$7.000

$5.560

$5.230

Continental Prestige Electronics

USA . 923 parts In-Stock

1+ parts

$9.740

100+ parts

$5.230

1k+ parts

$5.030

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923

$9.740

$5.230

$5.030

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Perfect Parts

USA . 66,304 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,227 parts In-Stock

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Infinite Electronics LLP (Excess)

. 15,002 parts In-Stock

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15,002

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Kulean Microsystems

USA . 5,885 parts In-Stock

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5,885

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SupplyDigital Components

Austria . 4,605 parts In-Stock

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4,605

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Problanco Electronics

Mexico . 3,212 parts In-Stock

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3,212

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Futuretech Components

Singapore . 2,500 parts In-Stock

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2,500

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TANS Electronics

Latvia . 2,086 parts In-Stock

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2,086

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Authorized Procurement Solutions

USA . 1,362 parts In-Stock

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1,362

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GreenTree Electronics

Israel . 1,221 parts In-Stock

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UHIMA Technologies

Türkiye . 312 parts In-Stock

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312

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Overview

Unlock seamless communication between PECL and TTL devices with the MC100EPT21DTR2G by Onsemi. Crafted with precision and quality in mind, this voltage level translator offers unparalleled reliability and performance. Ideal for industrial applications, this small outline, thin profile package ensures a smooth transition between differing voltage levels with ease. Experience the value of effortless signal conversion and enhance your system's efficiency with the MC100EPT21DTR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V ensures compatibility with a wide range of systems and devices.

Package Shape: SQUARE

The square package shape provides a compact form factor, ideal for applications with limited space constraints.

Power Supplies (V): 3.3

The 3.3V power supply offers stable and reliable operation for the voltage level translator.

No. of Terminals: 8

The 8 terminals provide ample connectivity options for interfacing with other components in the system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enhances the product's versatility and compatibility with various PCB layouts.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures reliable operation even under low voltage conditions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product can withstand high-temperature environments without performance degradation.

Minimum Operating Temperature: -40 °C

The product can operate efficiently in cold temperatures as low as -40 °C, making it suitable for a wide range of temperature conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: DUAL

The dual terminal position allows for flexibility in PCB layout and enables multiple connection options.

Maximum Seated Height: 1.1 mm

The low seated height of 1.1mm minimizes the overall profile of the product, suitable for compact designs.

Width: 3 mm

The 3mm width offers a compact form factor, ideal for space-constrained applications.

Output Polarity: TRUE

Having true output polarity ensures accurate signal translation, reducing the risk of errors in data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures reliable soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C ensures proper soldering of the product onto PCBs, maintaining strong electrical connections.

Length: 3 mm

The 3mm length complements the compact width and seated height, providing a well-balanced form factor for various applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Technology: ECL

The ECL technology offers high-speed operation and low power consumption, suitable for applications requiring fast data processing.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during assembly, ensuring robust connections.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard power sources, making integration easier.

Maximum Delay: 2.25 ns

With a maximum delay of 2.25ns, the product offers fast signal translation, ideal for high-speed data transmission applications.

Terminal Pitch: 0.65 mm

The 0.65mm terminal pitch allows for precise and efficient connections on the PCB, reducing the risk of signal interference.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates the product's resilience to moisture exposure during storage and handling.

Interface IC Type: PECL TO TTL TRANSLATOR

The interface IC type of PECL to TTL translator offers seamless signal translation between different voltage levels, enhancing compatibility.

Technical Specifications

Voltage Level Translators MC100EPT21DTR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.25 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC100EPT21DTR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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