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MC10ELT20DTR2

Onsemi

MC10ELT20DTR2 by Onsemi

MC10ELT20DTR2 by Onsemi is a voltage level translator with max supply voltage of 5.25V, min supply voltage of 4.75V, and max delay of 1.25ns. It's used for TTL/CMOS to PECL translation in industrial applications due to its ECL technology and temp range of -40 °C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,541 parts In-Stock

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2,541

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Digiode

USA . 1,535 parts In-Stock

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1,535

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 603 parts In-Stock

1+ parts

$18.980

100+ parts

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603

$18.980

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QUARKTWIN TECHNOLOGY LTD

USA . 18,378 parts In-Stock

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Kulean Microsystems

USA . 7,250 parts In-Stock

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7,250

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TANS Electronics

Latvia . 5,488 parts In-Stock

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5,488

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Microchip USA

USA . 3,477 parts In-Stock

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3,477

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Corphita

USA . 1,616 parts In-Stock

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1,616

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Problanco Electronics

Mexico . 1,170 parts In-Stock

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SupplyDigital Components

Austria . 785 parts In-Stock

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785

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Corohmni

South Africa . 465 parts In-Stock

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465

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UHIMA Technologies

Türkiye . 369 parts In-Stock

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369

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Overview

Experience seamless voltage level translation with the MC10ELT20DTR2 by Onsemi. Crafted with precision and reliability, this voltage level translator is a game-changer in the industry. From industrial automation to telecommunications, this versatile product offers unparalleled performance and efficiency. Say goodbye to compatibility issues and hello to streamlined operations with the MC10ELT20DTR2. Upgrade your systems today and elevate your business to new heights with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage tolerance provides flexibility in power source options and ensures reliable performance even under variable voltage conditions.

Package Shape: SQUARE

The square package shape offers a compact design that can fit efficiently within limited space constraints in electronic devices.

Power Supplies (V): -5.2

The dual power supply option of -5.2V allows for compatibility with a wide range of power sources, enhancing the product's versatility.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature rating of 85 °C ensures reliable performance in various environmental conditions, making it suitable for industrial applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and ensures a strong connection, increasing the product's reliability in electronic circuits.

Maximum Seated Height: 1.1 mm

The low maximum seated height allows for a compact overall design, making it ideal for applications where space is limited.

Width: 3 mm

The narrow width of 3mm enables the product to be used in space-constrained designs, providing flexibility in layout and placement on circuit boards.

Output Polarity: COMPLEMENTARY

The complementary output polarity ensures signal integrity and compatibility with a wide range of systems, making it a versatile choice for voltage translation applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating indicates that the product can withstand harsh operating conditions, making it suitable for use in demanding industrial environments.

Technology: ECL

The use of ECL technology offers high-speed operation and low power consumption, making it ideal for applications requiring fast signal translation with minimal power usage.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides compatibility with standard voltage levels, ensuring seamless integration into a wide range of electronic systems.

Maximum Delay: 1.25 ns

The low maximum delay of 1.25 ns ensures fast signal translation, making it suitable for high-speed applications where timing is critical.

Interface IC Type: TTL/CMOS TO PECL TRANSLATOR

The interface IC type allows for seamless translation between different logic levels, making it a versatile choice for interfacing various types of circuits.

Technical Specifications

Voltage Level Translators MC10ELT20DTR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

1.25 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

MC10ELT20DTR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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