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SN100KT5564DW

Texas Instruments

SN100KT5564DW by Texas Instruments

SN100KT5564DW by Texas Instruments is an 8-function voltage level translator with a package style of small outline. Operating temperature ranges from 0 to 85°C, with output polarity inverted and terminal pitch at 1.27mm. Ideal for TTL to ECL transceiver applications due to its ECL technology and compact rectangular design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,592 parts In-Stock

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8,592

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Digiode

USA . 915 parts In-Stock

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915

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,276 parts In-Stock

1+ parts

$9.503

100+ parts

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$10.105

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2,276

$9.503

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$10.105

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DigiPath Technology Company

USA . 469 parts In-Stock

1+ parts

$10.463

100+ parts

$9.626

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469

$10.463

$9.626

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ChromeModa Solutions

Germany . 1,363 parts In-Stock

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$10.677

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$8.755

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1,363

$10.677

$8.755

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IDEA Electronic Components Group

UK . 1,095 parts In-Stock

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$10.677

100+ parts

$10.143

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$9.609

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1,095

$10.677

$10.143

$9.609

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AZTECH Wire

Italy . 250 parts In-Stock

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$18.624

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250

$18.624

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One Stop Electronics

USA . 170 parts In-Stock

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$22.500

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$22.500

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Corphita

USA . 913 parts In-Stock

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Overview

Unlock the power of seamless voltage level translation with the SN100KT5564DW from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability in their products. This voltage level translator offers 8 functions in a compact rectangular package, making it ideal for a wide range of applications. With a temperature range of 0 to 85°C and inverted output polarity, this versatile device provides value and performance that customers can trust. Upgrade your designs with the SN100KT5564DW and experience the benefits of superior technology and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the voltage level translator, ensuring a longer lifespan.

Surface Mount: YES

The ability to be surface mounted allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 8

With 8 functions, this voltage level translator can handle a variety of different tasks and input/output requirements, making it versatile for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on a circuit board, optimizing the layout and design of the overall system.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options for interfacing with other components, giving flexibility in circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions, making it suitable for a wide range of applications.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance outputs when not actively transmitting data, reducing power consumption and enabling efficient operation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments, making it suitable for a variety of operating conditions.

Terminal Position: DUAL

The dual terminal position provides redundancy and ensures secure connections, minimizing the risk of signal loss or disconnection.

Maximum Seated Height: 2.65 mm

The low maximum seated height allows for compact and slim designs, enabling the voltage level translator to be used in space-constrained applications.

Width: 7.5 mm

The narrow width facilitates easy integration into tight spaces on a circuit board, enabling efficient use of available space and resources.

Output Polarity: INVERTED

The inverted output polarity allows for compatibility with systems that require inverted signals, expanding the range of applications where this voltage translator can be used.

Length: 15.4 mm

The compact length of the voltage level translator makes it suitable for applications with limited space, without compromising on functionality or performance.

Technology: ECL

The ECL technology used in this voltage level translator offers high-speed operation and low power consumption, making it ideal for demanding applications that require fast data processing.

Terminal Form: GULL WING

The gull wing terminal form provides robust and reliable connections, ensuring stable signal transmission and minimizing the risk of signal loss or interference.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density packaging and efficient use of space on a circuit board, enabling compact and space-saving designs.

Interface IC Type: TTL TO ECL TRANSCEIVER

This interface IC type allows for seamless communication between TTL and ECL devices, enabling compatibility and interoperability between different systems and components.

Technical Specifications

Voltage Level Translators SN100KT5564DW attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SN100KT5564DW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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