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SN74GTL2006PWRE4

Texas Instruments

SN74GTL2006PWRE4 by Texas Instruments

SN74GTL2006PWRE4 by Texas Instruments is a voltage level translator with 13 functions, operating at 3.3V. It features a max supply voltage of 3.6V and can handle temperatures from -40 to 85°C. Ideal for GTL to TTL transceiver applications due to its BICMOS technology and compact design with small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,855 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,855

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Digiode

USA . 2,121 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,121

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,342 parts In-Stock

1+ parts

$7.543

100+ parts

$700.459

1k+ parts

$6.788

10k+ parts

-

2,342

$7.543

$700.459

$6.788

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DigiPath Technology Company

USA . 1,289 parts In-Stock

1+ parts

$8.306

100+ parts

-

1k+ parts

-

10k+ parts

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1,289

$8.306

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IDEA Electronic Components Group

UK . 1,826 parts In-Stock

1+ parts

$8.475

100+ parts

$8.051

1k+ parts

$7.628

10k+ parts

-

1,826

$8.475

$8.051

$7.628

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ChromeModa Solutions

Germany . 176 parts In-Stock

1+ parts

$8.475

100+ parts

$6.950

1k+ parts

-

10k+ parts

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176

$8.475

$6.950

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One Stop Electronics

USA . 1,275 parts In-Stock

1+ parts

$15.500

100+ parts

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1k+ parts

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10k+ parts

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1,275

$15.500

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AZTECH Wire

Italy . 658 parts In-Stock

1+ parts

$18.896

100+ parts

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1k+ parts

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658

$18.896

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Corphita

USA . 3,750 parts In-Stock

1+ parts

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3,750

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Overview

Unlock seamless voltage translation with the SN74GTL2006PWRE4 by Texas Instruments. Crafted by a trusted manufacturer known for superior quality, this voltage level translator is perfect for a wide range of applications. Whether you're looking to bridge different voltage systems or ensure signal integrity, this product offers unbeatable value and reliability. Say goodbye to compatibility issues and hello to smooth, efficient operation with the SN74GTL2006PWRE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the internal components, making the product reliable for long-term use.

Surface Mount: YES

Surface mount feature allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Can handle a maximum supply voltage of 3.6V, making it compatible with various power requirements and ensuring stable performance.

No. of Functions: 13

With 13 functions, this voltage level translator offers versatility and flexibility in adapting different voltage levels for multiple applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing circuit designs and layouts, facilitating seamless connection with other components.

Power Supplies (V): 3.3

Operates on a power supply of 3.3V, which is a common and widely used voltage level in many electronic devices, ensuring compatibility.

No. of Terminals: 28

28 terminals provide ample connections for interfacing with other components and systems, offering flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline and thin profile design with shrink pitch make it suitable for compact and space-constrained applications, ideal for modern electronics.

Minimum Supply Voltage: 3 V

Requires a minimum supply voltage of 3V, ensuring efficient power consumption and compatibility with a wide range of voltage sources.

Maximum Operating Temperature: 85 °C

Operational up to 85°C, making it suitable for industrial applications where higher temperatures may be encountered.

Minimum Operating Temperature: -40 °C

Capable of functioning at extremely low temperatures of -40°C, ensuring reliability in harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides good conductivity and corrosion resistance, ensuring reliable connections for long-term use.

Terminal Position: DUAL

Dual terminal position allows for secure and stable connections, reducing the risk of signal loss or interference in data transmission.

Maximum Seated Height: 1.2 mm

Low seated height of 1.2mm enables a compact and space-efficient design, suitable for applications where height restrictions are a concern.

Width: 4.4 mm

Narrow width of 4.4mm facilitates easy integration into tight spaces and densely populated PCB layouts, improving overall design flexibility.

Output Polarity: TRUE

True output polarity ensures reliable signal transmission and compatibility with various digital logic circuits for seamless integration.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring secure solder connections during assembly and rework processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for efficient and reliable soldering during manufacturing processes, ensuring product quality.

Length: 9.7 mm

Compact length of 9.7mm makes it suitable for space-constrained applications, providing flexibility in PCB layout and design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environmental conditions typically encountered in industrial applications.

Technology: BICMOS

Utilizes BiCMOS technology for improved performance and efficiency, combining the advantages of bipolar and CMOS technologies for optimal operation.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable connections, facilitating ease of soldering and ensuring stable electrical connections.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V provides stable and consistent power supply for the device, ensuring reliable operation under varying conditions.

Maximum Delay: 10 ns

Low maximum delay of 10ns ensures fast and efficient signal transmission, reducing latency and improving overall performance in data communication.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm allows for high-density packaging and precise connections, enabling compact and space-saving designs.

Interface IC Type: GTL TO TTL TRANSCEIVER

GTl to TTL transceiver interface IC type provides seamless conversion and communication between different signal voltage levels, ensuring compatibility in diverse applications.

Technical Specifications

Voltage Level Translators SN74GTL2006PWRE4 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

10 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

13

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74GTL2006PWRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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