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SN10KHT5575NT

Texas Instruments

SN10KHT5575NT by Texas Instruments

SN10KHT5575NT by Texas Instruments is a voltage level translator with 8 functions, operating temperature range of 0-75°C. It features 3-state output characteristics and inverted polarity, suitable for ECL to TTL translation applications. Package dimensions are 31.64mm x 7.62mm x 5.08mm in an in-line rectangular shape with through-hole terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,373 parts In-Stock

1+ parts

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7,373

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Digiode

USA . 2,674 parts In-Stock

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2,674

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 810 parts In-Stock

1+ parts

$4.500

100+ parts

-

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810

$4.500

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Parana Technologies

USA . 238 parts In-Stock

1+ parts

$7.378

100+ parts

-

1k+ parts

$7.871

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238

$7.378

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$7.871

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DigiPath Technology Company

USA . 2,116 parts In-Stock

1+ parts

$8.124

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2,116

$8.124

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IDEA Electronic Components Group

UK . 2,349 parts In-Stock

1+ parts

$8.290

100+ parts

$7.876

1k+ parts

$7.461

10k+ parts

-

2,349

$8.290

$7.876

$7.461

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ChromeModa Solutions

Germany . 1,042 parts In-Stock

1+ parts

$8.290

100+ parts

$6.798

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-

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1,042

$8.290

$6.798

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AZTECH Wire

Italy . 506 parts In-Stock

1+ parts

$16.199

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506

$16.199

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Corphita

USA . 1,330 parts In-Stock

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1,330

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Overview

Unlock seamless voltage level translation with the SN10KHT5575NT by Texas Instruments. Crafted with precision and expertise, this innovative voltage level translator offers unparalleled quality and reliability. Perfect for a wide range of applications, this product boasts 8 functions in a compact rectangular package. With advanced features like 3-STATE output characteristics and INVERTED polarity, customers can trust in the performance and efficiency of this technology. Elevate your projects with the SN10KHT5575NT and experience the value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

No. of Functions: 8

Having 8 functions in one device provides versatility and flexibility in voltage level translation tasks.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into existing circuit layouts, saving space and ensuring efficient use of board real estate.

No. of Terminals: 24

The ample number of terminals allows for easy connectivity with other components, making installation and integration hassle-free.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, this product can perform reliably even in challenging environments with increased heat levels.

Output Characteristics: 3-STATE

The 3-state output characteristics provide additional flexibility in managing output signals, allowing for more control in voltage translation scenarios.

Terminal Position: DUAL

Dual terminal position enhances ease of connection and ensures secure attachment on the PCB, reducing the risk of disconnection or signal loss.

Width: 7.62 mm

The compact width of the product makes it suitable for applications with limited space, enabling efficient placement on the circuit board.

Output Polarity: INVERTED

Inverted output polarity offers compatibility with various systems and devices that require this specific output configuration.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with common voltage standards, simplifying integration into existing circuits.

Technical Specifications

Voltage Level Translators SN10KHT5575NT attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

0 ns

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDIP-T24

Length:

31.64 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

LATCH

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN10KHT5575NT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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