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NB6LQ572MNG

Onsemi

NB6LQ572MNG by Onsemi

NB6LQ572MNG by Onsemi is a voltage level translator with 4 bits and 32 terminals. It operates b/w -40 to 85 °C, with supply voltage range of 2.375V to 2.625V. Ideal for PECL to LVPECL transceiver applications due to its low delay of 10ns and industrial temperature grade suitability.

Median Price

$9.270

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1 parts In-Stock

1+ parts

$11.670

100+ parts

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1

$11.670

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Rochester

USA . 19 parts In-Stock

1+ parts

-

100+ parts

$6.870

1k+ parts

$6.150

10k+ parts

$5.780

19

-

$6.870

$6.150

$5.780

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,286 parts In-Stock

1+ parts

$7.258

100+ parts

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1,286

$7.258

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Vyrian

USA . 6,954 parts In-Stock

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6,954

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,466 parts In-Stock

1+ parts

$6.876

100+ parts

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1,466

$6.876

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Corohmni

South Africa . 325 parts In-Stock

1+ parts

$7.640

100+ parts

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325

$7.640

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Microchip USA

USA . 8,758 parts In-Stock

1+ parts

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8,758

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Problanco Electronics

Mexico . 5,962 parts In-Stock

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5,962

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SupplyDigital Components

Austria . 5,366 parts In-Stock

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5,366

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Kulean Microsystems

USA . 4,984 parts In-Stock

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4,984

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TANS Electronics

Latvia . 4,094 parts In-Stock

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4,094

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UHIMA Technologies

Türkiye . 160 parts In-Stock

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Perfect Parts

USA . 80 parts In-Stock

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80

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Overview

Upgrade your voltage level translation needs with the NB6LQ572MNG by Onsemi! As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. This voltage level translator is perfect for applications requiring smooth signal translation, offering seamless communication between different voltage domains. With its compact square package shape and impressive 4-bit design, this chip carrier delivers high performance while maintaining a very thin profile. Say goodbye to compatibility issues and hello to efficient signal transfer with the NB6LQ572MNG - the ultimate solution for your voltage level translation requirements.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy assembly onto circuit boards, saving time and effort in production.

Maximum Supply Voltage: 2.625 V

Can handle a relatively high supply voltage, providing flexibility in various applications.

Package Shape: SQUARE

Square package shape helps in efficient use of space on the circuit board.

No. of Bits: 4

Offers precise conversion of data signals with a 4-bit resolution.

No. of Terminals: 32

Ample number of terminals for connecting to different components in a circuit.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles provide options for different mounting and thermal management requirements.

Minimum Supply Voltage: 2.375 V

Can operate even at low supply voltages, making it suitable for applications with power constraints.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring reliability in harsh environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold conditions, expanding its range of applications.

Terminal Finish: TIN

Tin terminal finish provides good solderability and conductivity, enhancing overall performance.

Terminal Position: QUAD

Quad terminal position offers better stability and ease of connection in the circuit.

Maximum Seated Height: 1 mm

Low seated height allows for compact design and space-saving in the overall system.

Width: 5 mm

Optimal width dimension for fitting into standard circuit board layouts.

Output Polarity: COMPLEMENTARY

Complementary output polarity ensures accurate signal conversion and transmission.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for 30 seconds, ensuring proper solder joints during assembly.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures, suitable for lead-free soldering processes.

Length: 5 mm

Optimal length dimension for fitting into standard circuit board layouts.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where reliability and durability are essential.

Terminal Form: NO LEAD

No-lead terminal form provides better thermal performance and reliability in solder joints.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance in the specified operating conditions.

Maximum Delay: 10 ns

Low delay time ensures quick signal transmission, critical for high-speed applications.

Interface IC Type: PECL TO LVPECL TRANSCEIVER

Specific interface IC type for converting PECL signals to LVPECL, enabling compatibility between different signal standards.

Technical Specifications

Voltage Level Translators NB6LQ572MNG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT 3.3 V

Maximum Delay:

10 ns

Interface IC Type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NB6LQ572MNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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