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MC100H603FNG

Onsemi

MC100H603FNG by Onsemi

MC100H603FNG by Onsemi is a voltage level translator with 9 functions, operating at 0-85 °C. It has ECL technology, output polarity is complementary, and offers 12 ns max delay. Ideal for ECL to TTL translation applications due to its 3-STATE output characteristics and quad terminal position.

Median Price

$7.852

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 481 parts In-Stock

1+ parts

-

100+ parts

$6.980

1k+ parts

$6.250

10k+ parts

$5.880

481

-

$6.980

$6.250

$5.880

Verical

USA . 481 parts In-Stock

1+ parts

-

100+ parts

$8.725

1k+ parts

-

10k+ parts

-

481

-

$8.725

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,347 parts In-Stock

1+ parts

$7.391

100+ parts

-

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2,347

$7.391

-

-

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Vyrian

USA . 8,650 parts In-Stock

1+ parts

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8,650

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,681 parts In-Stock

1+ parts

$7.002

100+ parts

-

1k+ parts

-

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-

1,681

$7.002

-

-

-

Corohmni

South Africa . 302 parts In-Stock

1+ parts

$7.780

100+ parts

-

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302

$7.780

-

-

-

AZTECH Wire

Italy . 224 parts In-Stock

1+ parts

$13.830

100+ parts

-

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224

$13.830

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SupplyDigital Components

Austria . 8,317 parts In-Stock

1+ parts

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8,317

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TANS Electronics

Latvia . 6,956 parts In-Stock

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6,956

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Problanco Electronics

Mexico . 6,349 parts In-Stock

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6,349

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Microchip USA

USA . 5,902 parts In-Stock

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5,902

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Kulean Microsystems

USA . 2,486 parts In-Stock

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2,486

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UHIMA Technologies

Türkiye . 807 parts In-Stock

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807

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Continental Prestige Electronics

USA . 481 parts In-Stock

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481

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Kepictronics

USA . 481 parts In-Stock

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481

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Overview

Unlocking seamless voltage level translation, the MC100H603FNG by Onsemi sets a new standard in reliability and performance. Crafted with precision using cutting-edge technology, this voltage level translator offers unparalleled value and benefits to customers. Ideal for a wide range of applications, this product boasts top-notch quality, efficiency, and versatility. Experience the difference with Onsemi's MC100H603FNG and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 5.5 V

Can handle high voltage inputs, making it versatile for a variety of applications.

No. of Functions: 9

Offers multiple functions in a single device, reducing the need for additional components.

Package Shape: SQUARE

Optimal shape for efficient use of space on a circuit board.

Power Supplies (V): 5,-4.5

Supports both positive and negative supply voltages, increasing compatibility with different systems.

No. of Terminals: 28

Provides ample connection points for interfacing with other components.

Package Style (Meter): CHIP CARRIER

Chip carrier package style allows for easy handling and installation.

Minimum Supply Voltage: 4.5 V

Can operate at low voltage levels, suitable for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ideal for applications in harsh environments.

Output Characteristics: 3-STATE

3-state outputs provide flexibility for controlling external devices.

Minimum Operating Temperature: 0 °C

Can operate in cold temperatures, making it suitable for a wide range of environments.

Terminal Finish: TIN

Tin finish provides good electrical conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position allows for easy connection to external components.

Maximum Seated Height: 4.57 mm

Low seated height saves space on the circuit board.

Width: 11.505 mm

Compact width allows for efficient use of space on the circuit board.

Output Polarity: COMPLEMENTARY

Complementary outputs provide balanced signal levels for reliable data transmission.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during reflow soldering process.

Length: 11.505 mm

Compact length allows for efficient placement on the circuit board.

Technology: ECL

ECL technology offers high-speed operation and low power consumption.

Terminal Form: J BEND

J bend terminal form allows for easy insertion and removal from the circuit board.

Output Latch/Register: LATCH

Latch outputs hold their state until changed, providing stability in data transmission.

Nominal Supply Voltage: 5 V

5V nominal supply voltage is common in many electronic systems, ensuring compatibility.

Nominal Negative Supply Voltage: -4.5 V

Supports both positive and negative supply voltages for versatile use.

Maximum Delay: 12 ns

Low maximum delay ensures fast signal processing for real-time applications.

Terminal Pitch: 1.27 mm

1.27mm terminal pitch allows for high-density mounting on the circuit board.

Interface IC Type: ECL TO TTL TRANSLATOR

ECL to TTL translator interface IC type enables translation between different signal levels, allowing for seamless communication between different systems.

Technical Specifications

Voltage Level Translators MC100H603FNG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

12 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Nominal Negative Supply Voltage:

-4.5 V

No. of Bits:

1

No. of Functions:

9

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

LATCH

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-4.5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100H603FNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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