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MC10H602FNR2G

Onsemi

MC10H602FNR2G by Onsemi

MC10H602FNR2G by Onsemi is a voltage level translator with 28 terminals, operating b/w -5.2V to 5V. It has a max delay of 3.2ns and operates in temperatures ranging from 0 °C to 75°C. Ideal for TTL to ECL translation applications due to its ECL10K technology and open-emitter output characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,323 parts In-Stock

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Digiode

USA . 960 parts In-Stock

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AZTECH Wire

Italy . 375 parts In-Stock

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$12.050

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Component Stockers USA

USA . 553 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 5,981 parts In-Stock

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SupplyDigital Components

Austria . 5,981 parts In-Stock

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Problanco Electronics

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UHIMA Technologies

Türkiye . 810 parts In-Stock

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TANS Electronics

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Corohmni

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Microchip USA

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Corphita

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Overview

Discover the Onsemi MC10H602FNR2G, a high-quality voltage level translator that offers seamless integration and reliable performance. With a focus on innovation and precision engineering, Onsemi delivers cutting-edge solutions for a variety of applications. This versatile chip carrier package is designed for ease of use and maximum efficiency, making it ideal for TTL to ECL translation. Experience the value and benefits of Onsemi's advanced technology with the MC10H602FNR2G, where quality meets functionality for unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the electronic components inside the package.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

Can handle up to 5.5V supply voltage, making it suitable for a wide range of applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB.

Power Supplies (V): 5,-5.2

Supports both positive and negative power supplies, enhancing flexibility in system design.

No. of Terminals: 28

With 28 terminals, this product offers multiple input and output options for connecting with other components.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides a compact and lightweight form factor, suitable for space-constrained applications.

Minimum Supply Voltage: 4.5 V

Can operate efficiently with a minimum supply voltage of 4.5V, ensuring reliable performance even under low power conditions.

Maximum Operating Temperature: 75 °C

Capable of operating at temperatures up to 75 °C, suitable for a broad range of environmental conditions.

Output Characteristics: OPEN-EMITTER

Open-emitter output characteristics provide flexibility in connecting with other devices or components in the circuit.

Minimum Operating Temperature: 0 °C

Can operate at temperatures as low as 0 °C, making it suitable for various temperature environments.

Terminal Finish: TIN

TIN terminal finish offers good conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: QUAD

Quad terminal position provides multiple connection points for ease of integration with other components.

Maximum Seated Height: 4.57 mm

Low seated height of 4.57mm helps in reducing the overall profile of the PCB assembly.

Width: 11.505 mm

With a width of 11.505mm, this product can fit into compact spaces on the PCB.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission between different voltage levels.

Peak Reflow Temperature °C: 260

Can withstand peak reflow temperatures of up to 260 °C during assembly processes.

Length: 11.505 mm

With a length of 11.505mm, this product offers a compact footprint on the PCB.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade allows for reliable operation in a wide range of temperature conditions.

Technology: ECL10K

Utilizes ECL10K technology, known for high-speed and low-power consumption characteristics.

Terminal Form: J BEND

J bend terminal form facilitates easy soldering and robust mechanical connections.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V ensures compatibility with standard power sources.

Nominal Negative Supply Voltage: -5.2 V

Supports a nominal negative supply voltage of -5.2V, enabling bidirectional signal translation.

Maximum Delay: 3.2 ns

Low maximum delay of 3.2ns ensures fast signal transmission and minimal latency.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this product offers easy integration into standard PCB layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating ensures that the product can withstand moderate exposure to moisture during handling and storage.

Interface IC Type: TTL TO ECL TRANSLATOR

Designed as a TTL to ECL translator, enabling seamless communication between devices operating at different logic levels.

Technical Specifications

Voltage Level Translators MC10H602FNR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.2 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL10K

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10H602FNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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