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MC100LVELT22DTR2G

Onsemi

MC100LVELT22DTR2G by Onsemi

MC100LVELT22DTR2G by Onsemi is a voltage level translator with 2 functions, operating at 3.3V. It has a max supply voltage of 3.8V and can handle temperatures from -40 to 85 °C. Ideal for TTL/CMOS to PECL translation in industrial applications due to its ECL technology and compact design.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 1,704 parts In-Stock

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Digiode

USA . 1,088 parts In-Stock

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Prism Electronics

USA . 3 parts In-Stock

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Kulean Microsystems

USA . 7,736 parts In-Stock

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SupplyDigital Components

Austria . 5,873 parts In-Stock

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TANS Electronics

Latvia . 4,472 parts In-Stock

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Kepictronics

USA . 2,841 parts In-Stock

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UHIMA Technologies

Türkiye . 469 parts In-Stock

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Corphita

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Problanco Electronics

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Corohmni

South Africa . 134 parts In-Stock

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Perfect Parts

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Overview

Enhance your electronic designs with the MC100LVELT22DTR2G by Onsemi, a top-quality voltage level translator that offers seamless signal conversion for various applications. With Onsemi's reputation for reliable and innovative products, you can trust in the performance and durability of this device. Whether you're working on telecommunications, data communications, or industrial automation projects, this voltage level translator provides unmatched value, efficiency, and ease of use. Upgrade your circuits today with the MC100LVELT22DTR2G and experience the benefits of precision engineering and advanced technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the voltage level translator.

Surface Mount: YES

Allows for easy and secure installation on a circuit board, saving space and reducing assembly time.

Maximum Supply Voltage: 3.8 V

Can handle higher voltage levels, making it suitable for a wide range of applications.

No. of Functions: 2

Offers versatility by providing multiple voltage translation functions in a single device.

Package Shape: SQUARE

Efficient use of space on the circuit board, allowing for more compact designs.

Power Supplies (V): 3.3

Works with common power supply voltages, ensuring compatibility with existing systems.

No. of Terminals: 8

Provides multiple connection points for interfacing with other components, increasing flexibility in circuit design.

Minimum Supply Voltage: 3 V

Can operate at low voltage levels, suitable for power-sensitive applications.

Maximum Operating Temperature: 85 °C

Can withstand high-temperature environments, ensuring reliable performance in various conditions.

Output Characteristics: OPEN-EMITTER

Provides an open-collector output, allowing for easy interfacing with a variety of logic levels.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature environments, making it suitable for a wide range of applications.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant finish for the terminals, ensuring long-term performance.

Terminal Position: DUAL

Offers multiple terminal positions for easy connectivity in different circuit layouts.

Maximum Seated Height: 1.1 mm

Low profile design saves space on the circuit board, ideal for compact electronic devices.

Width: 3 mm

Compact size allows for efficient use of space in the circuit design.

Output Polarity: COMPLEMENTARY

Supports complementary logic, enabling bidirectional communication between different voltage domains.

Length: 3 mm

Compact size contributes to space-saving in the overall circuit design.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature specifications, ensuring reliable operation in harsh environments.

Technology: ECL

Uses Emitter-Coupled Logic technology for high-speed and high-performance voltage translation.

Terminal Form: GULL WING

Gull-wing terminals provide secure and reliable connections, ideal for surface mount applications.

Nominal Supply Voltage: 3.3 V

Optimal voltage level for compatibility with standard power supplies and logic levels.

Maximum Delay: 0.6 ns

Offers fast signal propagation with minimal delay, ideal for high-speed applications.

Terminal Pitch: 0.65 mm

Close terminal pitch allows for compact design and efficient use of space on the circuit board.

Interface IC Type: TTL/CMOS TO PECL TRANSLATOR

Supports translation between different logic levels, enabling seamless communication between TTL/CMOS and PECL circuits.

Technical Specifications

Voltage Level Translators MC100LVELT22DTR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.6 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

MC100LVELT22DTR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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