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MC100EPT26DR2G

Onsemi

MC100EPT26DR2G by Onsemi

MC100EPT26DR2G by Onsemi is a voltage level translator with 3.3V power supply, operating from -40 to 85 °C. It features PECL to TTL translation, 2.2ns max delay, and 40mA max supply current. Ideal for industrial applications requiring precise signal conversion in compact SMD package.

Median Price

$5.970

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22,448 parts In-Stock

1+ parts

-

100+ parts

$5.160

1k+ parts

$4.620

10k+ parts

$4.340

22,448

-

$5.160

$4.620

$4.340

DigiKey

USA . 17,448 parts In-Stock

1+ parts

-

100+ parts

$5.970

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17,448

-

$5.970

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Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$6.450

1k+ parts

$5.775

10k+ parts

-

5,000

-

$6.450

$5.775

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,142 parts In-Stock

1+ parts

$5.970

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2,142

$5.970

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Bristol Electronics

USA . 4,366 parts In-Stock

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4,366

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Inventory MP

USA . 1,926 parts In-Stock

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1,926

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Digiode

USA . 592 parts In-Stock

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592

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Distributors (Availability)

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Ampacity Inc.

Singapore . 19,480 parts In-Stock

1+ parts

$5.070

100+ parts

-

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19,480

$5.070

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Corohmni

South Africa . 361 parts In-Stock

1+ parts

$5.970

100+ parts

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361

$5.970

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Perfect Parts

USA . 24,806 parts In-Stock

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24,806

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Microchip USA

USA . 7,083 parts In-Stock

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7,083

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RC Electronics

USA . 6,887 parts In-Stock

1+ parts

-

100+ parts

$5.670

1k+ parts

$5.170

10k+ parts

$5.020

6,887

-

$5.670

$5.170

$5.020

Kulean Microsystems

USA . 6,015 parts In-Stock

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SupplyDigital Components

Austria . 4,727 parts In-Stock

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4,727

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Problanco Electronics

Mexico . 4,617 parts In-Stock

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TANS Electronics

Latvia . 3,408 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 1,790 parts In-Stock

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Assy Fe

Spain . 1,490 parts In-Stock

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1,490

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UHIMA Technologies

Türkiye . 828 parts In-Stock

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828

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Kepictronics

USA . 50 parts In-Stock

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50

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Overview

Upgrade your voltage level translation with the MC100EPT26DR2G by Onsemi. This versatile PECL to TTL translator offers exceptional quality and performance, making it the perfect solution for a wide range of applications. From industrial settings to consumer electronics, this small outline package ensures seamless integration and reliable operation. Experience the benefits of precise signal conversion, efficient power management, and superior thermal performance. Trust Onsemi for cutting-edge technology that delivers value and reliability to meet your unique design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and can withstand various environmental conditions, making this product a reliable choice.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this voltage level translator can handle a wide range of input signals, providing flexibility in usage.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product can operate effectively in extreme cold environments, ensuring reliability in various conditions.

Maximum Seated Height: 1.75 mm

The compact maximum seated height of 1.75 mm makes this voltage level translator suitable for applications with space constraints.

Maximum Delay: 2.2 ns

With a maximum delay of 2.2 ns, this voltage level translator provides fast signal translation, making it ideal for high-speed applications.

Technical Specifications

Voltage Level Translators MC100EPT26DR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.2 ns

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100EPT26DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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