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MC10H125P

Onsemi

MC10H125P by Onsemi

MC10H125P by Onsemi is a voltage level translator with 4 functions, operating at 5.25V max and 4.75V min. It features ECL technology, totem-pole output, and ECL to TTL translation, suitable for commercial extended temperature grade applications.

Median Price

$2.644

Lifecycle Status

Suppliers In-Stock

51

In-Stock Inventory

1k+

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Farnell

UK . 91 parts In-Stock

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Freelance Electronics

USA . 258 parts In-Stock

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Component Electronics Inc.

Canada . 13 parts In-Stock

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Ampacity Inc.

Singapore . 91 parts In-Stock

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Corohmni

South Africa . 350 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Canada . 653 parts In-Stock

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Türkiye . 249 parts In-Stock

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UK . 194 parts In-Stock

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Overview

Elevate your voltage level translation needs with the MC10H125P by Onsemi. Crafted with precision by a trusted manufacturer, this innovative device offers unparalleled quality and reliability. Whether you're in the telecommunications, industrial automation, or automotive industry, this voltage level translator is the perfect solution for seamless signal processing. Experience the value of smooth signal transitions, enhanced efficiency, and improved performance with the MC10H125P. Upgrade your projects today and unlock endless possibilities with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for electronics applications.

Maximum Supply Voltage: 5.25 V

Can handle high supply voltages without getting damaged, providing reliability and safety in voltage translation.

No. of Functions: 4

Multiple functions in a single device offer versatile voltage translation capabilities, reducing the need for multiple components.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit boards, optimizing space utilization.

Power Supplies (V): 5,-5.2

Supports both positive and negative power supplies, enabling bi-directional voltage level translation.

No. of Terminals: 16

Sufficient number of terminals for connecting various input and output signals, enhancing compatibility with different systems.

Package Style (Meter): IN-LINE

In-line package style facilitates smooth installation and alignment on circuit boards, improving overall system design.

Minimum Supply Voltage: 4.75 V

Low minimum supply voltage requirement ensures compatibility with a wide range of power sources, making it versatile in different applications.

Maximum Operating Temperature: 75 °C

High operating temperature range allows the product to operate reliably in various environmental conditions, increasing its performance and durability.

Output Characteristics: TOTEM-POLE

Totem-pole output structure enhances signal integrity and reliability, ensuring accurate voltage translation.

Minimum Operating Temperature: 0 °C

Can operate in low temperature environments, making it suitable for a wide range of applications.

Terminal Finish: Tin/Lead (Sn80Pb20)

Tin/Lead terminal finish provides good solderability and conductivity, ensuring stable connections in the circuit.

Terminal Position: DUAL

Dual terminal position design offers flexibility in mounting options, optimizing space utilization on the circuit board.

Maximum Seated Height: 4.44 mm

Low seated height minimizes the overall profile of the product, ideal for compact electronic devices.

Width: 7.62 mm

Narrow width design allows for efficient utilization of PCB space, enabling compact and streamlined circuit layouts.

Output Polarity: TRUE

True output polarity ensures accurate voltage level translation, reducing the risk of signal distortion or errors.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient amount of time during soldering processes, ensuring reliable manufacturing.

Peak Reflow Temperature °C: 235

High peak reflow temperature capability allows for reliable soldering without damaging the product.

Length: 19.175 mm

Optimal length for easy integration into circuit board layouts, providing a compact and efficient solution for voltage translation.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures reliable operation in a wide range of temperature conditions, suitable for diverse applications.

Technology: ECL

ECL technology offers high-speed and high-performance voltage translation, making it ideal for demanding applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form simplifies the assembly process, providing secure and stable connections on the circuit board.

Nominal Supply Voltage: 5 V

Compatible with standard 5V supply voltages, ensuring seamless integration with existing systems and components.

Nominal Negative Supply Voltage: -5.2 V

Supports negative supply voltages for bi-directional voltage level translation, expanding the range of compatible power sources.

Maximum Delay: 3.35 ns

Low maximum delay ensures fast and efficient voltage translation, preserving signal integrity and accuracy.

Terminal Pitch: 2.54 mm

Standard terminal pitch facilitates easy soldering and connection to the circuit board, simplifying the assembly process.

Interface IC Type: ECL TO TTL TRANSLATOR

Specifically designed for translating signals between ECL and TTL interfaces, providing seamless interoperability between different logic levels.

Technical Specifications

Voltage Level Translators MC10H125P attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.35 ns

Interface IC Type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

TOTEM-POLE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.62 mm

Trade Compliance

MC10H125P Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-229-0500, 5962012290500

NIIN

012290500

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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