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MC100ELT23MNR4

Onsemi

MC100ELT23MNR4 by Onsemi

MC100ELT23MNR4 by Onsemi is a voltage level translator with 2 functions, operating at -40 to 85 °C. It has a max supply voltage of 5.25 V and delay of 5.5 ns, suitable for PECL to TTL translation in industrial applications.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 1,131 parts In-Stock

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Digiode

USA . 376 parts In-Stock

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Kulean Microsystems

USA . 7,997 parts In-Stock

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SupplyDigital Components

Austria . 7,874 parts In-Stock

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TANS Electronics

Latvia . 5,186 parts In-Stock

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Problanco Electronics

Mexico . 4,061 parts In-Stock

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Corphita

USA . 327 parts In-Stock

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Corohmni

South Africa . 261 parts In-Stock

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UHIMA Technologies

Türkiye . 85 parts In-Stock

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Overview

Upgrade your voltage level translation needs with the MC100ELT23MNR4 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. This voltage level translator boasts a maximum supply voltage of 5.25 V and operates in industrial-grade temperatures ranging from -40 to 85 °C. With its small outline package style and dual terminal position, this device is perfect for a wide range of applications. Experience seamless signal conversion and unmatched performance with the MC100ELT23MNR4, providing value and efficiency to customers like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB integration, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this voltage level translator can handle a wide range of input voltages with ease.

No. of Functions: 2

Having 2 functions means this voltage level translator can perform multiple tasks efficiently, increasing its versatility.

Package Shape: SQUARE

The square package shape is compact and allows for efficient placement on the PCB, saving space.

Power Supplies (V): 5

Operating at a standard 5V power supply makes it easy to integrate into existing systems without additional power considerations.

No. of Terminals: 8

The 8 terminals provide ample connection points for interfacing with other components, enhancing flexibility.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and thin profile make this voltage level translator suitable for space-constrained applications while the heat sink/slug design helps in dissipating heat efficiently.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures compatibility with a wide range of systems and applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this voltage level translator can withstand harsh environmental conditions, ensuring reliability.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for operation in extreme cold conditions, making it suitable for various environments.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability and ensures a reliable connection.

Terminal Position: DUAL

Dual terminal position allows for easy and flexible PCB layout, enhancing design options.

Maximum Seated Height: 1 mm

The low seated height makes this voltage level translator suitable for compact designs where space is limited.

Width: 2 mm

The narrow width contributes to the compact form factor, optimizing board space utilization.

Output Polarity: TRUE

True output polarity ensures accurate translation of voltage levels, improving overall system performance.

Length: 2 mm

The short length helps in maintaining a compact footprint on the PCB, saving space.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, ensuring reliable operation in harsh industrial environments.

Technology: ECL

ECL technology offers fast switching speeds and high noise immunity, ideal for high-performance applications.

Terminal Form: NO LEAD

No-lead terminal form helps in minimizing PCB trace lengths, reducing signal losses and improving signal integrity.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, simplifying integration.

Maximum Delay: 5.5 ns

The low maximum delay ensures quick signal translation, making it suitable for high-speed applications.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm allows for high-density PCB layouts, optimizing space utilization.

Interface IC Type: PECL TO TTL TRANSLATOR

This specific interface IC type allows for seamless translation between PECL and TTL signals, making it suitable for a wide range of applications.

Technical Specifications

Voltage Level Translators MC100ELT23MNR4 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

5.5 ns

Interface IC Type:

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e0

Length:

2 mm

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

MC100ELT23MNR4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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