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MC10H125MEL

Onsemi

MC10H125MEL by Onsemi

MC10H125MEL by Onsemi is a voltage level translator with 4 functions, operating at 5.25V max and 4.75V min. It has a small outline package style, suitable for ECL to TTL translation applications with dual terminal position and peak reflow temp of 260 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,389 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,333 parts In-Stock

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Bristol Electronics

USA . 1,333 parts In-Stock

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Dan-Mar Components

USA . 1,333 parts In-Stock

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Digiode

USA . 388 parts In-Stock

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Problanco Electronics

Mexico . 8,360 parts In-Stock

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Kulean Microsystems

USA . 5,976 parts In-Stock

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TANS Electronics

Latvia . 5,623 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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SupplyDigital Components

Austria . 3,152 parts In-Stock

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Corphita

USA . 2,312 parts In-Stock

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Corohmni

South Africa . 434 parts In-Stock

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Microchip USA

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Kepictronics

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UHIMA Technologies

Türkiye . 115 parts In-Stock

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Overview

Unlock the power of seamless voltage level translation with the MC10H125MEL from Onsemi. With a reputation for superior quality and reliability, Onsemi's Voltage Level Translators are designed to meet the demands of various applications with ease. Whether you're in the automotive, industrial or consumer electronics industry, this innovative product offers unmatched value, benefits, and advantages. Experience smooth signal transmission and improved performance with the MC10H125MEL - your go-to solution for efficient voltage level translation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Being surface mountable enables easy integration into PCB designs.

Maximum Supply Voltage: 5.25 V

Support for a high maximum supply voltage allows for versatile use in various applications.

No. of Functions: 4

Having multiple functions in a single device offers added functionality and flexibility.

Package Shape: RECTANGULAR

Rectangular shape provides ease of placement and compactness in circuit layouts.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures reliable performance in diverse environments.

Maximum Seated Height: 2.05 mm

Low seated height facilitates space-saving designs and compact setups.

Width: 5.275 mm

Compact width dimension allows for efficient space utilization on the PCB.

Output Polarity: TRUE

Correct output polarity ensures accurate signal translation and compatibility.

Technology: ECL

Employing ECL technology offers high-speed and low-power consumption benefits.

Technical Specifications

Voltage Level Translators MC10H125MEL attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.35 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H125MEL Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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