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MC10ELT28MNR4

Onsemi

MC10ELT28MNR4 by Onsemi

MC10ELT28MNR4 by Onsemi is a voltage level translator with 2 functions, operating b/w -40 to 85 °C. It has a supply voltage range of 4.75-5.25 V and max delay of 5.5 ns. Ideal for PECL-TTL/TTL-PECL translation in industrial applications due to its ECL technology and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 946 parts In-Stock

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Vyrian

USA . 755 parts In-Stock

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755

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TANS Electronics

Latvia . 6,913 parts In-Stock

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SupplyDigital Components

Austria . 6,671 parts In-Stock

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Kulean Microsystems

USA . 2,667 parts In-Stock

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Corphita

USA . 1,988 parts In-Stock

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Problanco Electronics

Mexico . 1,646 parts In-Stock

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UHIMA Technologies

Türkiye . 782 parts In-Stock

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Corohmni

South Africa . 449 parts In-Stock

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Overview

Upgrade your voltage level translation needs with the MC10ELT28MNR4 by Onsemi. This cutting-edge device offers unparalleled quality and reliability, thanks to the trusted manufacturer behind it. Ideal for a wide range of applications, this product provides seamless communication between different voltage levels, ensuring smooth operations and optimal performance. Experience the value and benefits of this high-quality voltage translator that will take your projects to the next level. Trust Onsemi for all your voltage level translation needs.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and convenient mounting on a circuit board, saving valuable space and making installation more efficient.

Maximum Supply Voltage: 5.25 V

Supports a high maximum supply voltage, providing flexibility in various voltage level translation applications.

No. of Functions: 2

Having multiple functions in one device can simplify the design and reduce the overall component count in a circuit.

Package Shape: SQUARE

The square package shape offers good stability and ease of handling during installation, ensuring a secure fit on the PCB.

Power Supplies (V): 5

Operating at a common power supply voltage of 5V makes it compatible with typical electronic systems, simplifying integration.

No. of Terminals: 8

Having a sufficient number of terminals allows for easy connectivity with other components and peripherals in the circuit.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The compact and slim package style saves space on the PCB, while the integrated heat sink helps dissipate heat efficiently for reliable operation.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing the versatility of the device.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for industrial environments where temperature variations are common.

Minimum Operating Temperature: -40 °C

With a wide range of minimum operating temperature, it can withstand extreme cold conditions, increasing its reliability in various applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability and reliability in assembly processes, ensuring a stable electrical connection.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in circuit design and ease of connection, accommodating different wiring configurations.

Maximum Seated Height: 1 mm

The low seated height profile enables a compact and space-efficient design, especially beneficial for applications with height constraints.

Width: 2 mm

The narrow width helps in conserving space on the PCB and allows for a more streamlined layout of components for better circuit integration.

Output Polarity: COMPLEMENTARY

Complementary output polarity ensures accurate voltage level translation and compatibility between different logic systems, reducing signal interference.

Length: 2 mm

The short length contributes to the overall compactness of the device, facilitating efficient placement on the PCB and optimizing board real estate.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this temperature grade ensures reliable operation under harsh environmental conditions, making it suitable for rugged settings.

Technology: ECL

Employing ECL (Emitter-Coupled Logic) technology provides high-speed and low-power consumption characteristics, making it ideal for demanding signal processing tasks.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and offers a more environmentally friendly solution during disposal.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard voltage levels in electronic systems, promoting seamless integration.

Maximum Delay: 5.5 ns

With a low maximum delay, this product facilitates fast signal translation between PECL and TTL logic levels, ensuring reliable and quick data communication.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for precise and compact connections on the PCB, enabling high-density circuit designs and efficient signal routing.

Interface IC Type: PECL-TTL/TTL-PECL TRANSLATOR

Supports bidirectional translation between PECL and TTL logic signals, expanding compatibility and communication capabilities in mixed-signal systems.

Technical Specifications

Voltage Level Translators MC10ELT28MNR4 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

5.5 ns

Interface IC Type:

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e0

Length:

2 mm

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

MC10ELT28MNR4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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