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MC10125P

Onsemi

MC10125P by Onsemi

MC10125P by Onsemi is a voltage level translator with 4 functions, operating at 5V and -5.2V. It features ECL10K technology, TOTEM-POLE output characteristics, and a max delay of 6ns. Ideal for ECL to TTL translation applications due to its through-hole terminal form and true output polarity.

Median Price

$32.150

Lifecycle Status

Suppliers In-Stock

63

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1k+

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Rochester

USA . 94 parts In-Stock

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Canada . 108 parts In-Stock

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South Africa . 108 parts In-Stock

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Corphita

USA . 2,366 parts In-Stock

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Speed Components Ltd (Excess)

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Overview

Experience seamless voltage level translation with the MC10125P by Onsemi. With a reputation for producing high-quality components, Onsemi delivers a reliable solution for your voltage level translation needs. This versatile device is ideal for a wide range of applications, offering customers unparalleled value and performance. Say goodbye to compatibility issues and hello to smooth operation with the MC10125P. Trust Onsemi to provide the innovation and excellence you've been searching for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and lightweight, ideal for portable applications.

No. of Functions: 4

Having multiple functions in a single device provides versatility and efficiency in a circuit design.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into standard PCB layouts.

Power Supplies (V): 5,-5.2

Support for both positive and negative power supplies enhances compatibility with a wide range of systems.

No. of Terminals: 16

With 16 terminals, this product offers flexibility in connecting to other components in a circuit.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even under harsh environmental conditions.

Output Characteristics: TOTEM-POLE

The totem-pole output structure allows for high-speed and efficient signal transmission.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature enables this product to be used in a wide range of temperature environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and ensures a strong electrical connection.

Terminal Position: DUAL

The dual terminal position allows for easy integration into different circuit layouts and configurations.

Maximum Seated Height: 4.44 mm

The low seated height makes this product suitable for applications with space constraints.

Width: 7.62 mm

The compact width of the product enables efficient use of space on the PCB.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission between different voltage levels.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time allows for fast and reliable soldering during manufacturing.

Peak Reflow Temperature °C: 235

The high peak reflow temperature ensures proper soldering and strong joints for reliable performance.

Length: 19.175 mm

The compact length of the product helps in saving space on the PCB while maintaining functionality.

Technology: ECL10K

The ECL10K technology provides high-speed operation and low power consumption, ideal for efficient voltage translation.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers robust mechanical support and ease of installation on the PCB.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard voltage levels in electronics.

Nominal Negative Supply Voltage: -5.2 V

The -5.2V nominal negative supply voltage supports bidirectional signal translation in the circuit.

Maximum Delay: 6 ns

The low maximum delay ensures fast signal transmission and minimal signal distortion.

Terminal Pitch: 2.54 mm

The standard terminal pitch allows for easy connection to other components on the PCB.

Interface IC Type: ECL TO TTL TRANSLATOR

The ECL to TTL translator interface IC type provides seamless integration between ECL and TTL logic levels.

Technical Specifications

Voltage Level Translators MC10125P attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

6 ns

Interface IC Type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

TOTEM-POLE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Level Translators

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

ECL10K

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.62 mm

Trade Compliance

MC10125P Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-160-7082, 5962011607082, 5962-00-626-3626, 5962006263626

NIIN

011607082, 006263626

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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