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JM38510/06302BFA

Onsemi

JM38510/06302BFA by Onsemi

JM38510/06302BFA by Onsemi is a voltage level translator with 4 functions, MIL-M-38510 Class B screening. Operating from -55 to 125 °C, it features ECL to TTL translation for military applications in a flatpack style package. Dimensions: 9.65mm x 6.415mm x 2.15mm with true output polarity and totem-pole characteristics.

Median Price

$27.040

Lifecycle Status

Suppliers In-Stock

8

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1k+

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American Microsemiconductor Inc.

USA . 3 parts In-Stock

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$27.831

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Digiode

USA . 2,366 parts In-Stock

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Vyrian

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Mil-Aero Solutions, Inc.

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Electronic Expediters

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Bristol Electronics

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Corohmni

South Africa . 112 parts In-Stock

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Kulean Microsystems

USA . 6,598 parts In-Stock

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Problanco Electronics

Mexico . 5,204 parts In-Stock

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SupplyDigital Components

Austria . 3,220 parts In-Stock

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TANS Electronics

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UHIMA Technologies

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Overview

Elevate your electronic designs with the JM38510/06302BFA voltage level translator from Onsemi. With a reputation for top-notch quality and reliability, Onsemi delivers cutting-edge solutions for a wide range of applications. This versatile voltage translator offers customers unparalleled value, benefits, and advantages, making it an essential component for any project. Whether you're looking to enhance performance or streamline operations, the JM38510/06302BFA is the perfect choice for maximizing efficiency and achieving optimal results. Trust Onsemi to provide innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides durability and reliability for the voltage level translator, making it suitable for long-term use in various environments.

Surface Mount: YES

The surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

No. of Functions: 4

Having 4 functions in one device increases efficiency and reduces the need for multiple separate components, saving on costs and board space.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and makes it easy to position and mount the voltage level translator onto a circuit board.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this voltage level translator can withstand harsh environmental conditions and operate reliably in elevated temperature settings.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V makes this voltage level translator compatible with standard electronic systems, enhancing its versatility and usability.

Technical Specifications

Voltage Level Translators JM38510/06302BFA attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-CDFP-F16

Length:

9.65 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

TOTEM-POLE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

2.15 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.415 mm

Trade Compliance

JM38510/06302BFA Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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