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MC100LVELT23DTR2G

Onsemi

MC100LVELT23DTR2G by Onsemi

MC100LVELT23DTR2G by Onsemi is a voltage level translator with 3.3V power supply, operating b/w -40 to 85 °C. It features ECL100K technology, GULL WING terminals, and a small outline package shape. Ideal for industrial applications requiring precise voltage translation in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,106 parts In-Stock

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Digiode

USA . 113 parts In-Stock

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Problanco Electronics

Mexico . 6,214 parts In-Stock

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TANS Electronics

Latvia . 5,422 parts In-Stock

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Kulean Microsystems

USA . 4,504 parts In-Stock

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SupplyDigital Components

Austria . 4,052 parts In-Stock

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UHIMA Technologies

Türkiye . 520 parts In-Stock

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Corphita

USA . 463 parts In-Stock

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Corohmni

South Africa . 70 parts In-Stock

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Overview

Unlock new possibilities with the MC100LVELT23DTR2G from Onsemi. This voltage level translator offers unparalleled quality and reliability, making it the top choice for a wide range of applications. With its innovative design and advanced technology, this product ensures seamless communication between different voltage levels, providing customers with unmatched value and performance. Whether you're in industrial automation, telecommunications, or networking, the MC100LVELT23DTR2G is the perfect solution to elevate your projects to the next level. Trust Onsemi for all your voltage level translation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and resistance to harsh environmental conditions, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 3.3

Compatible with a common voltage supply, making integration into existing systems straightforward.

No. of Terminals: 8

Provides flexibility for connecting multiple components, enabling versatile applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact size and design optimize space utilization on the circuit board, ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures without compromising performance, ensuring reliability under various conditions.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold environments, expanding the product's application range.

Terminal Position: DUAL

Allows for more stable connections and better signal transmission, improving overall performance.

Temperature Grade: INDUSTRIAL

Designed for industrial applications where temperature fluctuations are common, ensuring reliability in harsh environments.

Technology: ECL100K

Utilizes advanced technology for efficient voltage level translation, enhancing the product's performance.

Terminal Form: GULL WING

Enables easy soldering and secure mechanical connections, contributing to the product's overall reliability.

Nominal Supply Voltage: 3.3 V

Matches the standard supply voltage for many electronic devices, ensuring compatibility with various systems.

Terminal Pitch: 0.635 mm

Provides precise spacing for terminals, facilitating accurate connections and reducing the risk of errors during installation.

Technical Specifications

Voltage Level Translators MC100LVELT23DTR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Level Translators

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL100K

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

MC100LVELT23DTR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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