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MC10ELT21DR2G

Onsemi

MC10ELT21DR2G by Onsemi

MC10ELT21DR2G by Onsemi is a voltage level translator with 8 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 4.75V to 5.25V and offers true output polarity with a delay of 5.5ns. Ideal for PECL to TTL translation in industrial applications due to its ECL technology and small outline package style.

Median Price

$1.420

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 324 parts In-Stock

1+ parts

$9.640

100+ parts

$4.130

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324

$9.640

$4.130

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Rochester

USA . 576 parts In-Stock

1+ parts

-

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$1.420

1k+ parts

$1.270

10k+ parts

$1.190

576

-

$1.420

$1.270

$1.190

Mouser Electronics

USA . 37 parts In-Stock

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-

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$1.410

37

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$1.410

Distributors (In-Stock)

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Digiode

USA . 1,464 parts In-Stock

1+ parts

$1.482

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$1.482

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Flip Electronics

USA . 10,000 parts In-Stock

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Vyrian

USA . 3,158 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 686 parts In-Stock

1+ parts

$1.404

100+ parts

-

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686

$1.404

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Corohmni

South Africa . 245 parts In-Stock

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$1.410

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245

$1.410

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Perfect Parts

USA . 100,845 parts In-Stock

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100,845

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QUARKTWIN TECHNOLOGY LTD

USA . 21,497 parts In-Stock

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GreenTree Electronics

Israel . 20,330 parts In-Stock

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Lixinc

USA . 17,792 parts In-Stock

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Authorized Procurement Solutions

USA . 10,330 parts In-Stock

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Problanco Electronics

Mexico . 6,638 parts In-Stock

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Microchip USA

USA . 5,457 parts In-Stock

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Kulean Microsystems

USA . 5,046 parts In-Stock

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TANS Electronics

Latvia . 3,017 parts In-Stock

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SupplyDigital Components

Austria . 840 parts In-Stock

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Kepictronics

USA . 500 parts In-Stock

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UHIMA Technologies

Türkiye . 100 parts In-Stock

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Overview

Unlock seamless voltage level translation with the MC10ELT21DR2G by Onsemi. Crafted with precision and expertise, this voltage translator offers unmatched performance and reliability. Perfect for a wide range of applications, this product ensures smooth signal transitions and efficient communication between devices. Experience the value of superior quality and innovation with Onsemi's cutting-edge technology. Elevate your projects with the MC10ELT21DR2G and discover a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this voltage level translator can handle a wide range of input voltages, providing flexibility in various circuit designs.

Minimum Operating Temperature: -40 °C

The device can operate in extremely low temperatures, making it suitable for use in harsh environments or industrial settings.

Output Characteristics: TOTEM-POLE

The totem-pole output allows for both high and low output levels, providing reliable signal transmission in different scenarios.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during the manufacturing process, ensuring proper soldering and assembly.

Technical Specifications

Voltage Level Translators MC10ELT21DR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

5.5 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10ELT21DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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