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SN100KT5576DWR

Texas Instruments

SN100KT5576DWR by Texas Instruments

SN100KT5576DWR by Texas Instruments is a voltage level translator with 8 functions, operating b/w 0-85°C. It features a small outline package style, Gull Wing terminal form, and ECL to TTL translation interface. Ideal for applications requiring inverted output polarity and standard input characteristics in compact electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,274 parts In-Stock

1+ parts

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6,274

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Digiode

USA . 1,466 parts In-Stock

1+ parts

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1,466

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 644 parts In-Stock

1+ parts

$2.140

100+ parts

-

1k+ parts

$2.652

10k+ parts

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644

$2.140

-

$2.652

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DigiPath Technology Company

USA . 141 parts In-Stock

1+ parts

$2.356

100+ parts

-

1k+ parts

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141

$2.356

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ChromeModa Solutions

Germany . 6,078 parts In-Stock

1+ parts

$2.404

100+ parts

$1.971

1k+ parts

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6,078

$2.404

$1.971

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IDEA Electronic Components Group

UK . 314 parts In-Stock

1+ parts

$2.404

100+ parts

-

1k+ parts

$2.164

10k+ parts

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314

$2.404

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$2.164

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AZTECH Wire

Italy . 253 parts In-Stock

1+ parts

$5.412

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253

$5.412

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One Stop Electronics

USA . 681 parts In-Stock

1+ parts

$40.500

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681

$40.500

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Corphita

USA . 2,370 parts In-Stock

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2,370

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Overview

Unlock the full potential of your electronic devices with the SN100KT5576DWR voltage level translator from Texas Instruments. With a reputation for top-tier quality and reliability, this innovative product offers seamless voltage translation for various applications. Whether you're a tech enthusiast or a professional in the industry, this compact and efficient device ensures optimal performance and compatibility. Say goodbye to compatibility issues and experience smooth operation with the SN100KT5576DWR – because when it comes to voltage level translators, Texas Instruments leads the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material makes the package lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Facilitates easy installation on PCBs, saving space and providing a more efficient layout.

No. of Functions: 8

Offers versatility and flexibility in handling multiple voltage levels and signal conversions.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into existing circuit designs.

No. of Terminals: 24

Sufficient terminals for connection with various components, ensuring compatibility and ease of use.

Package Style (Meter): SMALL OUTLINE

Compact design saves space on the PCB and allows for more efficient placement of components.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliability in diverse environmental conditions.

Output Characteristics: 3-STATE

Ability to drive the output to a high impedance state provides flexibility in controlling the signal flow.

Minimum Operating Temperature: 0 °C

Low operating temperature ensures functionality in cold environments without compromising performance.

Terminal Position: DUAL

Dual terminal position allows for secure and stable connections with other devices.

Maximum Seated Height: 2.65 mm

Low seated height reduces the overall profile of the component, enabling compact designs.

Width: 7.5 mm

Narrow width facilitates efficient placement on the PCB, optimizing board space.

Output Polarity: INVERTED

Inverted output polarity suits applications where signal inversion is required for proper operation.

Length: 15.4 mm

Optimal length for accommodating multiple terminals and functions without occupying excessive space.

Technology: BIPOLAR

Bipolar technology delivers high-speed performance and compatibility with a wide range of voltage levels.

Terminal Form: GULL WING

Gull wing terminals offer secure and reliable connections, ideal for applications with frequent plug and unplug operations.

Input Characteristics: STANDARD

Standard input characteristics ensure compatibility with a variety of devices and voltage levels.

Output Latch/Register: REGISTER

Output register provides storage and memory capabilities, enhancing signal control and data retention.

Nominal Supply Voltage: 5 V

Common 5V supply voltage ensures compatibility with standard power sources and devices.

Nominal Negative Supply Voltage: -4.5 V

Negative supply voltage capability expands the versatility of the translator for use in diverse circuit configurations.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration into existing PCB layouts and designs.

Interface IC Type: ECL TO TTL TRANSLATOR

Specific interface IC type ensures seamless translation between ECL and TTL signal levels, enabling interconnection between different systems.

Technical Specifications

Voltage Level Translators SN100KT5576DWR attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Nominal Negative Supply Voltage:

-4.5 V

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

REGISTER

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SN100KT5576DWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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