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MC10ELT28DG

Onsemi

MC10ELT28DG by Onsemi

MC10ELT28DG by Onsemi is a voltage level translator with 2 functions, operating at -40 to 85 °C. It has a supply voltage range of 4.75-5.25 V and offers fast operation with a max delay of 5.5 ns. Ideal for industrial applications requiring PECL-TTL/TTL-PECL translation in compact designs.

Median Price

$3.880

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,465 parts In-Stock

1+ parts

$4.630

100+ parts

$3.470

1k+ parts

$3.320

10k+ parts

-

1,465

$4.630

$3.470

$3.320

-

Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

$2.800

10k+ parts

$2.630

2

-

$3.130

$2.800

$2.630

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,398 parts In-Stock

1+ parts

$3.306

100+ parts

-

1k+ parts

-

10k+ parts

-

1,398

$3.306

-

-

-

Vyrian

USA . 5,957 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,957

-

-

-

-

North Shore Components

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Benley Electronics

USA . 20 parts In-Stock

1+ parts

$0.250

100+ parts

-

1k+ parts

-

10k+ parts

-

20

$0.250

-

-

-

Corphita

USA . 1,525 parts In-Stock

1+ parts

$3.132

100+ parts

-

1k+ parts

-

10k+ parts

-

1,525

$3.132

-

-

-

Corohmni

South Africa . 77 parts In-Stock

1+ parts

$3.480

100+ parts

-

1k+ parts

-

10k+ parts

-

77

$3.480

-

-

-

Continental Prestige Electronics

USA . 1,688 parts In-Stock

1+ parts

$4.630

100+ parts

$3.470

1k+ parts

-

10k+ parts

-

1,688

$4.630

$3.470

-

-

AZTECH Wire

Italy . 470 parts In-Stock

1+ parts

$12.180

100+ parts

-

1k+ parts

-

10k+ parts

-

470

$12.180

-

-

-

TANS Electronics

Latvia . 7,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,475

-

-

-

-

Kulean Microsystems

USA . 6,654 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,654

-

-

-

-

Problanco Electronics

Mexico . 1,144 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,144

-

-

-

-

SupplyDigital Components

Austria . 734 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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734

-

-

-

-

Perfect Parts

USA . 726 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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726

-

-

-

-

UHIMA Technologies

Türkiye . 618 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

618

-

-

-

-

Microchip USA

USA . 115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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115

-

-

-

-

Overview

Elevate your voltage level translation needs with the MC10ELT28DG by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers quality and reliability with their voltage level translators. This product offers seamless translation between PECL-TTL/TTL-PECL interfaces, providing customers with efficient signal conversion for industrial applications. With a compact design and wide temperature range, the MC10ELT28DG ensures optimal performance in any environment. Trust Onsemi to deliver cutting-edge solutions that meet your voltage translation requirements with ease and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability makes installation easier and saves space on a PCB, making the product more efficient and easier to integrate into designs.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product is suitable for a wide range of applications where a higher voltage may be required.

No. of Functions: 2

Having 2 functions in a single device allows for more versatile use and flexibility in circuit designs.

Package Shape: RECTANGULAR

Rectangular package shape is a standard form factor that is easy to work with and fits well on a PCB.

Power Supplies (V): 5

Operating at a standard 5V power supply makes this product compatible with a wide range of systems and devices.

No. of Terminals: 8

Having 8 terminals provides ample connection points for various input and output signals, enabling more complex circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, allowing for more components to be placed in a limited area.

Minimum Supply Voltage: 4.75 V

Having a low minimum supply voltage allows for operation in systems where power may fluctuate or be limited.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in harsh environmental conditions or applications that generate heat.

Output Characteristics: OPEN-EMITTER

Open-emitter output characteristics provide flexibility in signal routing and processing, allowing for customized configurations.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature makes this product suitable for use in extreme cold environments without sacrificing performance.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good conductivity and solderability for secure connections in a PCB assembly process.

Terminal Position: DUAL

Dual terminal position allows for more stable and secure mounting on the PCB, reducing the risk of connection issues or damage.

Maximum Seated Height: 1.75 mm

Low maximum seated height helps in designing compact and slim devices without compromising functionality.

Width: 3.9 mm

Narrow width saves space on the PCB, enabling more components to be placed closer together for efficient circuit layout.

Output Polarity: COMPLEMENTARY

Complementary output polarity allows for efficient signal processing and compatibility with various types of input and output devices.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for a sufficient time window for the reflow soldering process, ensuring proper soldering of the component on the PCB.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures that the component can withstand the soldering process without damage or degradation.

Length: 4.9 mm

Compact length of the package makes it suitable for applications where space is limited, without compromising on functionality.

Temperature Grade: INDUSTRIAL

Industrial temperature grade makes this product suitable for use in industrial applications that may require higher temperature tolerance.

Technology: ECL

Employing ECL technology ensures high-speed signal processing and low power consumption, making the product efficient in data transmission.

Terminal Form: GULL WING

Gull wing terminal form provides a secure mechanical connection to the PCB, reducing the risk of disconnection or damage during operation.

Nominal Supply Voltage: 5 V

Operating at a standard 5V nominal supply voltage ensures compatibility with a wide range of systems and avoids overvoltage issues.

Maximum Delay: 5.5 ns

Low maximum delay ensures fast signal transmission, making this product ideal for high-speed data applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch makes it easy to mount the component on the PCB and provides compatibility with common assembly processes.

Interface IC Type: PECL-TTL/TTL-PECL TRANSLATOR

Supports PECL-TTL or TTL-PECL signal translation, making it versatile for interfacing between different logic levels in electronic systems.

Technical Specifications

Voltage Level Translators MC10ELT28DG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

5.5 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10ELT28DG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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